JPS6256660B2 - - Google Patents
Info
- Publication number
- JPS6256660B2 JPS6256660B2 JP56188627A JP18862781A JPS6256660B2 JP S6256660 B2 JPS6256660 B2 JP S6256660B2 JP 56188627 A JP56188627 A JP 56188627A JP 18862781 A JP18862781 A JP 18862781A JP S6256660 B2 JPS6256660 B2 JP S6256660B2
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- lower limit
- bonding arm
- arm
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001514 detection method Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 6
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56188627A JPS5889834A (ja) | 1981-11-25 | 1981-11-25 | ボンデイングヘツドの組立調整方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56188627A JPS5889834A (ja) | 1981-11-25 | 1981-11-25 | ボンデイングヘツドの組立調整方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5889834A JPS5889834A (ja) | 1983-05-28 |
| JPS6256660B2 true JPS6256660B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1987-11-26 |
Family
ID=16226996
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56188627A Granted JPS5889834A (ja) | 1981-11-25 | 1981-11-25 | ボンデイングヘツドの組立調整方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5889834A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
-
1981
- 1981-11-25 JP JP56188627A patent/JPS5889834A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5889834A (ja) | 1983-05-28 |