JPS6256657B2 - - Google Patents
Info
- Publication number
- JPS6256657B2 JPS6256657B2 JP56007752A JP775281A JPS6256657B2 JP S6256657 B2 JPS6256657 B2 JP S6256657B2 JP 56007752 A JP56007752 A JP 56007752A JP 775281 A JP775281 A JP 775281A JP S6256657 B2 JPS6256657 B2 JP S6256657B2
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- load
- capillary
- contact
- arm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56007752A JPS57121243A (en) | 1981-01-21 | 1981-01-21 | Load variable mechanism at wire bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56007752A JPS57121243A (en) | 1981-01-21 | 1981-01-21 | Load variable mechanism at wire bonder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57121243A JPS57121243A (en) | 1982-07-28 |
| JPS6256657B2 true JPS6256657B2 (enrdf_load_stackoverflow) | 1987-11-26 |
Family
ID=11674421
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56007752A Granted JPS57121243A (en) | 1981-01-21 | 1981-01-21 | Load variable mechanism at wire bonder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57121243A (enrdf_load_stackoverflow) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52124864A (en) * | 1976-04-13 | 1977-10-20 | Tokyo Sokuhan Kk | Wireebonder |
| JPS54101067A (en) * | 1978-01-26 | 1979-08-09 | Toyota Motor Corp | Damper |
-
1981
- 1981-01-21 JP JP56007752A patent/JPS57121243A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57121243A (en) | 1982-07-28 |