JPS57121243A - Load variable mechanism at wire bonder - Google Patents

Load variable mechanism at wire bonder

Info

Publication number
JPS57121243A
JPS57121243A JP56007752A JP775281A JPS57121243A JP S57121243 A JPS57121243 A JP S57121243A JP 56007752 A JP56007752 A JP 56007752A JP 775281 A JP775281 A JP 775281A JP S57121243 A JPS57121243 A JP S57121243A
Authority
JP
Japan
Prior art keywords
bonding
load
arm
variable mechanism
contactor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56007752A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6256657B2 (enrdf_load_stackoverflow
Inventor
Nobuhito Yamazaki
Kazuo Sugiura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Ltd
Priority to JP56007752A priority Critical patent/JPS57121243A/ja
Publication of JPS57121243A publication Critical patent/JPS57121243A/ja
Publication of JPS6256657B2 publication Critical patent/JPS6256657B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP56007752A 1981-01-21 1981-01-21 Load variable mechanism at wire bonder Granted JPS57121243A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56007752A JPS57121243A (en) 1981-01-21 1981-01-21 Load variable mechanism at wire bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56007752A JPS57121243A (en) 1981-01-21 1981-01-21 Load variable mechanism at wire bonder

Publications (2)

Publication Number Publication Date
JPS57121243A true JPS57121243A (en) 1982-07-28
JPS6256657B2 JPS6256657B2 (enrdf_load_stackoverflow) 1987-11-26

Family

ID=11674421

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56007752A Granted JPS57121243A (en) 1981-01-21 1981-01-21 Load variable mechanism at wire bonder

Country Status (1)

Country Link
JP (1) JPS57121243A (enrdf_load_stackoverflow)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52124864A (en) * 1976-04-13 1977-10-20 Tokyo Sokuhan Kk Wireebonder
JPS54101067A (en) * 1978-01-26 1979-08-09 Toyota Motor Corp Damper

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52124864A (en) * 1976-04-13 1977-10-20 Tokyo Sokuhan Kk Wireebonder
JPS54101067A (en) * 1978-01-26 1979-08-09 Toyota Motor Corp Damper

Also Published As

Publication number Publication date
JPS6256657B2 (enrdf_load_stackoverflow) 1987-11-26

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