JPS6253949B2 - - Google Patents
Info
- Publication number
- JPS6253949B2 JPS6253949B2 JP54144398A JP14439879A JPS6253949B2 JP S6253949 B2 JPS6253949 B2 JP S6253949B2 JP 54144398 A JP54144398 A JP 54144398A JP 14439879 A JP14439879 A JP 14439879A JP S6253949 B2 JPS6253949 B2 JP S6253949B2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- cap member
- package
- base
- aluminum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 229910052782 aluminium Inorganic materials 0.000 description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 10
- 238000002788 crimping Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000005394 sealing glass Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010897 surface acoustic wave method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14439879A JPS5669847A (en) | 1979-11-09 | 1979-11-09 | Hermetically sealed metal package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14439879A JPS5669847A (en) | 1979-11-09 | 1979-11-09 | Hermetically sealed metal package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5669847A JPS5669847A (en) | 1981-06-11 |
| JPS6253949B2 true JPS6253949B2 (US07922777-20110412-C00004.png) | 1987-11-12 |
Family
ID=15361226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14439879A Granted JPS5669847A (en) | 1979-11-09 | 1979-11-09 | Hermetically sealed metal package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5669847A (US07922777-20110412-C00004.png) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57200921U (US07922777-20110412-C00004.png) * | 1981-06-17 | 1982-12-21 | ||
| JPS58518U (ja) * | 1981-06-25 | 1983-01-05 | 富士産業株式会社 | 半田封止型水晶振動子 |
| JPH07111431A (ja) * | 1993-10-13 | 1995-04-25 | Wanotetsuku Japan:Kk | 電子部品用ケース |
| JP5553732B2 (ja) * | 2010-11-11 | 2014-07-16 | 株式会社神戸製鋼所 | 金属材の接合体 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4855668A (US07922777-20110412-C00004.png) * | 1971-11-12 | 1973-08-04 | ||
| JPS5014947B2 (US07922777-20110412-C00004.png) * | 1972-11-11 | 1975-05-31 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5014947U (US07922777-20110412-C00004.png) * | 1973-06-06 | 1975-02-17 |
-
1979
- 1979-11-09 JP JP14439879A patent/JPS5669847A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4855668A (US07922777-20110412-C00004.png) * | 1971-11-12 | 1973-08-04 | ||
| JPS5014947B2 (US07922777-20110412-C00004.png) * | 1972-11-11 | 1975-05-31 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5669847A (en) | 1981-06-11 |
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