JPS5669847A - Hermetically sealed metal package - Google Patents

Hermetically sealed metal package

Info

Publication number
JPS5669847A
JPS5669847A JP14439879A JP14439879A JPS5669847A JP S5669847 A JPS5669847 A JP S5669847A JP 14439879 A JP14439879 A JP 14439879A JP 14439879 A JP14439879 A JP 14439879A JP S5669847 A JPS5669847 A JP S5669847A
Authority
JP
Japan
Prior art keywords
cold
covered
members
collar
force
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14439879A
Other languages
Japanese (ja)
Other versions
JPS6253949B2 (en
Inventor
Fumio Okazaki
Tatsuo Toyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14439879A priority Critical patent/JPS5669847A/en
Publication of JPS5669847A publication Critical patent/JPS5669847A/en
Publication of JPS6253949B2 publication Critical patent/JPS6253949B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

PURPOSE:To obtain excellent air tightness with the working being simplified, in the case an aluminum cap member is covered on a metallic stem member and these are connected, by performing the cold compressing, the cold compressing utilizing ultrasonic waves, caulking, and the like. CONSTITUTION:A lead pin 3 is inserted through the metallic stem member 2 via a lead sealing glass 4. A slanted projection 2a is formed on the peripheral collar which is extended from the member 2 so as to surround the main body of the member 2. Then, the aluminum cap member 1 is covered on the member 2, and the peripheral collar of the cap member 1 and the collar of the member 2 are contacted. Then, a force is applied in the direction of the arrow A, these collars are cold compressed, the lattices of the molecules of both materials of the members 1 and 2 are coupled together, thereby the air tight connection is obtained. If the ultrasonic vibration is given, the junction can be more readily formed. Instead of the cold compressing, a packing 5 is inserted between the members 1 and 2, a force is applied from the direction of B, thereby a caulked part 1a may be formed in the member.
JP14439879A 1979-11-09 1979-11-09 Hermetically sealed metal package Granted JPS5669847A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14439879A JPS5669847A (en) 1979-11-09 1979-11-09 Hermetically sealed metal package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14439879A JPS5669847A (en) 1979-11-09 1979-11-09 Hermetically sealed metal package

Publications (2)

Publication Number Publication Date
JPS5669847A true JPS5669847A (en) 1981-06-11
JPS6253949B2 JPS6253949B2 (en) 1987-11-12

Family

ID=15361226

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14439879A Granted JPS5669847A (en) 1979-11-09 1979-11-09 Hermetically sealed metal package

Country Status (1)

Country Link
JP (1) JPS5669847A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57200921U (en) * 1981-06-17 1982-12-21
JPS58518U (en) * 1981-06-25 1983-01-05 富士産業株式会社 Solder-sealed crystal resonator
JPH07111431A (en) * 1993-10-13 1995-04-25 Wanotetsuku Japan:Kk Case for electronic component
JP2012101261A (en) * 2010-11-11 2012-05-31 Kobe Steel Ltd Joined body of metallic material

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4855668A (en) * 1971-11-12 1973-08-04
JPS5014947U (en) * 1973-06-06 1975-02-17

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5014947B2 (en) * 1972-11-11 1975-05-31

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4855668A (en) * 1971-11-12 1973-08-04
JPS5014947U (en) * 1973-06-06 1975-02-17

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57200921U (en) * 1981-06-17 1982-12-21
JPS58518U (en) * 1981-06-25 1983-01-05 富士産業株式会社 Solder-sealed crystal resonator
JPH07111431A (en) * 1993-10-13 1995-04-25 Wanotetsuku Japan:Kk Case for electronic component
JP2012101261A (en) * 2010-11-11 2012-05-31 Kobe Steel Ltd Joined body of metallic material

Also Published As

Publication number Publication date
JPS6253949B2 (en) 1987-11-12

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