JPS6252948A - Characteristics tester - Google Patents

Abstract

PURPOSE:To position a semiconductor device at a predetermined position securely and perform an accurate characteristics test by providing stoppers which touch the external leads of the semiconductor device. CONSTITUTION:Socket contacts 21 which are connected to the inside of a measuring part main body 20 are provided on a measured object placing part. A pair of stoppers 25 are provided on the measured object placing part so as to touch and leave freely the ends of external leads 24 lead out of an external package 23 of a semiconductor device 22, which is a measured object. With a characteristics tester 30 constituted as described above, as the stoppers 25 are provided so as to touch and leave the external leads 24 lead out of the external package 23, even if flashes 26 remain on the edge of the external package 23, the semiconductor device 22 can be always positioned at the measured object placing part accurately.

Description

[Detailed description of the invention] The present invention relates to a characteristic testing machine.

[Technical background of the invention]

Conventionally, DIP (Duag In-Pac
As shown in FIG. 3, the semiconductor device 1 of the kge ) type is supplied onto the measuring section main body 2 for a characteristic test, and a predetermined characteristic test is performed. A socket contactor 3 is provided on the object-to-be-measured mounting section of the measuring section main body 2 .

Therefore, the semiconductor device @l supplied to the tetI part of the object to be measured
The stopper 5 is brought into contact with the envelope 4 for positioning, and the socket contactor 3 is brought into contact with the external lead 6 of the semiconductor device 1 to perform a characteristic test.

[Problems with background technology]

However, since the envelope 4 is usually sealed with a resin, as shown in FIG.
Burr 2 often remains on the i part. If positioning is performed using the stopper 5 in such a state, the stopper 5 will come into contact with the burr 1, making it impossible to correctly position the semiconductor device 1 at a predetermined position. As a result, there was a problem in that it was not possible to conduct accurate characteristic tests.

[Purpose of the invention]

SUMMARY OF THE INVENTION An object of the present invention is to provide a characteristic testing machine that can be reliably positioned at a predetermined position on a semiconductor device and accurately perform a characteristic test.

[Summary of the invention]

The present invention is a characteristic testing machine that can reliably position a semiconductor device at a predetermined position and conduct a characteristic test accurately by providing nine stoppers that abut the external leads Vc of the semiconductor device.

[Implementation sequence of the invention]

An embodiment of the present invention will be described below with reference to the drawings. ! ! 1r! gJ is a schematic structure W of an embodiment of the present invention, t
- is an explanatory diagram showing. Reference numeral 20 in the figure represents a measuring unit main body having a resting part to be measured on the upper part.

A socket contactor 21 electrically connected to the inside of the foot measuring section main body 200 is provided on the measuring object mounting section. Measured 5
1i! A pair of stoppers 25 are provided in the body placement section so as to be brought into contact with and separated from the ends of the external leads 24 led out from the envelope 23 of the semiconductor device 22 that is the object to be measured. O According to the characteristic test +1Jso that has been bottomed out in this way, @
As shown at 211, the stopper 25 is provided so as to come into contact with and separate from the external lead 24 led out from the envelope 23, so even if the burr 26 remains at the base of the envelope 23, it will always be removed. The semiconductor device 22f can be correctly positioned at the measurement target mounting position. As a result, characteristic tests can be performed accurately.

〔Effect of the invention〕

As explained above, according to the characteristic testing machine according to the present invention,
Make sure the semiconductor device is in place! It is possible to accurately perform characteristic tests by positioning the

[Brief explanation of drawings]

Fig. 1 is an explanatory diagram showing the general configuration of the central tIA array of the present invention, Fig. 2 is an explanatory diagram showing the action of the same implementation array, and Fig. 3 is a schematic diagram of the groove bottom of a conventional characteristic testing machine. 4 and 5 are explanatory diagrams showing problems with conventional characteristic testing machines. 20... Measuring unit main body, 21... Socket feeler. 22... Semiconductor device, 23... Envelope, 24...
External lead, 25...Stock bar, xe;.../<
! ? , J (7...Characteristics testing machine. Figure 1 Figure 2 Figure 3 Figure 1! Figure 4 Figure 5

Claims (1)

[Claims] A measurement unit main body for performing a measurement test, a socket contactor electrically connected to the inside of the measurement unit main body and led out to an external measured object mounting part, and a socket contactor led out to the side of the measured object. A characteristic testing machine comprising: a stopper provided on the object-to-be-measured mounting section so as to freely approach and separate from one end of an external lead.