JPS58138058A - Semiconductor device - Google Patents

Abstract

PURPOSE:To ensure electrical contact among a plurality of terminals of the semiconductor device and a measuring jig under a state in which the semiconductor device is set up to the measuring jig and the terminals of the semiconductor device are held down by a hold-down jig, and to obtain the accurate measuring value of characteristics with excellent reproducibility by forming a plurality of small convex sections projected more than others in the direction of surfaces contacting with the measuring jig of the terminals to the root sections of the terminals. CONSTITUTION:When the semiconductor device is set up to the measuring jig 3, a plurality of the convex sections 2' are formed to the root sections of the terminals 2. Accordingly, there exists no problem because positive electrical contact is obtained in a plurality of the convex 2' sections when the terminals 2 are held down by the hold-down jigs 4, and the value of charcteristics to be measured can be acquired accurately with excellent reproducibility.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor device, particularly a flat type semiconductor device.

Electrical characteristics of flat semiconductor devices that generally have multiple terminals protruding from the main body on the same horizontal plane.

In particular, when inspecting high frequency characteristics, use an appropriate measurement tool AK1.
1. Mount the semiconductor device to be inspected, press the base portions of the plurality of terminals of the scissors semiconductor device with a round bar-shaped holding jig made of an insulating material, and electrically attach the plurality of terminals to the measurement jig. and measure its high frequency characteristics. Therefore, as is well known, there are large differences in the measured values of the high frequency characteristics to be tested depending on the contact state between each terminal of the semiconductor device to be tested and the measurement jig.

The present invention aims to improve such drawbacks in measuring characteristics.

The present invention provides a semiconductor device having a plurality of small protrusions on the base portions of a plurality of terminals of the semiconductor device that protrude in the direction of the surface where the terminals come into contact with a measuring jig.

If the base of the terminal has a plurality of protrusions as described above, the semiconductor device can be mounted on a measuring jig.

While holding down the terminal of the semiconductor device with the holding jig, electrical contact between the terminal and the measuring jig can be ensured, and accurate measurement values of 1% accuracy can be obtained with high consistency.

The effects of the present invention will be explained with reference to the drawings.

FIG. 1 is an example of an external view of a conventional flat conductor device, which consists of a main body 1 and a plurality of terminals 2 radially projecting from the main body in the same horizontal plane.

FIG. 2 is a state diagram when a conventional flat type semiconductor device is mounted on a measuring jig. A semiconductor device is mounted on a measuring jig 3, and the terminals 2 of the semiconductor device are held down with a round bar-shaped holding jig 4 made of an insulating material to bring the terminals 2 and the measuring jig 3 into electrical contact to measure the characteristics. However, since both the terminals of the semiconductor device and the measuring jig have flat surfaces, it is difficult to make electrical contact between them. The disadvantage is that accurate values cannot be obtained with good reproducibility because it is difficult to keep the contact position constant. In addition, there is also the disadvantage that the holding mechanism of the holding jig quickly wears out when it is necessary to forcefully press the Ka holding jig 4 to ensure electrical contact between the aIA element and the measuring jig. .

FIG. 3 is an example of an external view of a semiconductor device according to the present invention that solves the above-mentioned drawbacks. The base of the terminal 2 has nine projecting portions in the direction of the surface where the terminal contacts the measuring jig. It is characterized by having a small convex portion zlt.

FIG. 4 is a state diagram when the semiconductor device according to the present invention is mounted on the measuring jig 3. In this case, since the bottom part of the Kii terminal 2 has a plurality of protrusions 2', the presser jig 4
When the terminal 2 is pressed down, reliable electrical contact can be made at the plurality of convex portions 2', so the problems that occur in the conventional semiconductor device mentioned above are completely eliminated, and the value of the characteristic to be measured is can be obtained accurately and with good reproducibility. Of course, it can be effectively used for purposes other than measuring the convex portion Fi.

[Brief explanation of the drawing]

Figure 1 is an example of the outline drawing of a conventional flat type semiconductor device.
Fig. 2 is a state diagram of a conventional flat type semiconductor device mounted on a #1 regular jig; Fig. 3 is an example of an external view of a flat conductor device according to the present invention; Fig. 4 is an example of an external view of a flat conductor device according to the invention. flat semiconductor device t-
A state diagram when attached to a measurement jig is shown. In Figures 1 and 3! ... Main body of the semiconductor device, 2... One child of the semiconductor device. In FIGS. 2 and 4, 1... Main body of the semiconductor device, 2... Terminals of the semiconductor device, 3... Measurement jig, 4...
...In the presser jig, Figures 3 and 4

Claims (1)

[Claims] In a flat semiconductor device having a plurality of terminals protruding from the main body in the same horizontal plane, the plurality of terminals include:
A semiconductor device having a plurality of small convex portions that protrude in the direction of the surface where the terminal contacts the practical device when the semiconductor device is put into practical use.