JPH02122645A - Tray for manufacturing ic - Google Patents
Tray for manufacturing icInfo
- Publication number
- JPH02122645A JPH02122645A JP63277844A JP27784488A JPH02122645A JP H02122645 A JPH02122645 A JP H02122645A JP 63277844 A JP63277844 A JP 63277844A JP 27784488 A JP27784488 A JP 27784488A JP H02122645 A JPH02122645 A JP H02122645A
- Authority
- JP
- Japan
- Prior art keywords
- tray
- ics
- leads
- testing
- manufacturing process
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 238000012360 testing method Methods 0.000 abstract description 13
- 238000005259 measurement Methods 0.000 abstract description 2
- 239000000523 sample Substances 0.000 abstract 2
- 230000000694 effects Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はＩＣ製造工程に用いるＩＣ製造用トレーに関す
るものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an IC manufacturing tray used in an IC manufacturing process.
従来のこの種のトレーの断面図を第５図に示す。第５図
に示すように、ＩＣＩの大きさに合わせ、リード５を逃
げるだけの溝加工のみが施されている。A sectional view of a conventional tray of this type is shown in FIG. As shown in FIG. 5, only grooves are formed to accommodate the size of the ICI and allow the leads 5 to escape.
従って、ＩＣＩの電気特性試験等の作業時は１つ１つト
レーより取り出さなければならなかった。Therefore, when performing work such as testing the electrical characteristics of ICI, it was necessary to take them out one by one from the tray.
上述した従来のトレーは、ＩＣを１つ１つトレーより取
り出し電気特性試験等の作業をしなければならず、その
取り出し及び作業後の収納作業に要す時間は相当長時間
を要し、製造工程において、納期遅れの一つの原因とな
るという欠点がある。With the conventional trays mentioned above, each IC must be taken out of the tray one by one for electrical property testing, etc., and it takes a considerable amount of time to take out the ICs and store them after the work. There is a drawback in the process that it is one of the causes of delivery delays.
また、ＩＣに人間の手が接れることによりＩＣの外観不
良を発生させるという欠点もある。Furthermore, there is also the drawback that the IC's appearance becomes defective due to human hands coming into contact with the IC.
本発明の目的は、ＩＣ製造工程においてＩＣを外へ取出
すことなしに電気特性試験等を実施することができ、そ
の結果ＩＣの取り出し、収納の時間の短縮ができ、かつ
人手に触れずに作業できることにより外観不良の発生も
防止できるＩＣ製造用トレーを提供することにある。An object of the present invention is to be able to conduct electrical property tests, etc. during the IC manufacturing process without taking out the IC, thereby shortening the time required to take out and store the IC, and to perform work without manual intervention. It is an object of the present invention to provide a tray for IC manufacturing that can prevent appearance defects.
本発明のＩＣ製造用トレーは、ＩＣリードに合わせた穴
を有していることを特徴として構成される。The IC manufacturing tray of the present invention is characterized by having holes that match the IC leads.
第１図は本発明の一実施例の外観図、第２図は第１図の
要部の断面図である。FIG. 1 is an external view of one embodiment of the present invention, and FIG. 2 is a sectional view of the main part of FIG. 1.
第１図に示す様に、複数のＩＣ１を乗せたトレー２の底
面のＩＣのリードに合わせた位置に六３の加工を施して
おく。As shown in FIG. 1, 63 is processed on the bottom of the tray 2 on which a plurality of ICs 1 are placed, at positions that match the IC leads.
トレーに乗せたＩＣの電気特性試験時には、ＩＣをトレ
ー２より取出すことなく、六３より電気特性試験用の接
触子４を挿入し、ＩＣＩのり−ド５に接続させ測定する
。When testing the electrical characteristics of an IC placed on a tray, the IC is not removed from the tray 2, but a contact 4 for testing electrical characteristics is inserted through the 63, connected to the ICI board 5, and measured.
第３図は本発明の他の実施例の外観図である。FIG. 3 is an external view of another embodiment of the present invention.
第１の実施例と同様に、トレーの底面、ＩＣＩのリード
５に対する面にＩＣＩのリード数に合わせ、入り勝手を
持った六３の加工を施しておく。As in the first embodiment, the bottom surface of the tray, the surface facing the ICI leads 5, is machined with 63 to provide ease of insertion in accordance with the number of ICI leads.
通常の運搬時にはＩＣＩはバネ圧で上方へ持ち上げられ
た台６の上にあるが、電気特性試験を行なう際には、第
４図に示すようにＩＣＩの上方よりブツシャ−７で押す
ことにより、トレー底面へＩＣＩのリード５を出し、こ
れに電気特性試験用の接触子４を接続させ測定する。During normal transportation, the ICI is placed on a stand 6 that is lifted upward by spring pressure, but when conducting an electrical property test, the ICI is pushed from above with a pusher 7 as shown in Figure 4. The ICI lead 5 is taken out to the bottom of the tray, and the contact 4 for electrical property testing is connected to it for measurement.
この実施例では精度良く加工された穴３にＩＣ１のリー
ド３を入れるため、ＩＣＩを静止・固定する際の位置精
度が向上するという利点がある。In this embodiment, since the lead 3 of the IC 1 is inserted into the hole 3 machined with high accuracy, there is an advantage that the positional accuracy when stationary and fixing the ICI is improved.
以上説明したように、本発明のトレーはＩＣリードに合
わせた位置に穴を有しているので、ＩＣ製造工程におい
てＩＣを外へ取り出すことなく、電気特性試験等の作業
ができ、作業時間を短縮できる効果がある。As explained above, since the tray of the present invention has holes at positions that match the IC leads, it is possible to conduct electrical property tests during the IC manufacturing process without taking the ICs out, which saves time. It has the effect of shortening the time.
更に、製造工程内で人間の手がＩＣに触れることがなく
なり、人的なミスによるＩＣの外観不良の発生を防止で
きる効果がある。Furthermore, human hands do not touch the IC during the manufacturing process, which has the effect of preventing defects in the appearance of the IC due to human error.
第１図は本発明の一実施例の外観図、第２図は第１図の
要部断面図、第３図は本発明の池の実施例の断面図、第
４図は第３図の実施例の動作を示す断面図、第５図は従
来のトレーの断面図である。
１・・・ＩＣ１
２・・・トレー
３・・・穴、
４・・・電気特性
試験用接触子、
５・・・
ＩＣのリード、
６・・・台、
７・・・
プッシャーFIG. 1 is an external view of an embodiment of the present invention, FIG. 2 is a sectional view of the main part of FIG. 1, FIG. 3 is a sectional view of an embodiment of the pond of the present invention, and FIG. A sectional view showing the operation of the embodiment, and FIG. 5 is a sectional view of a conventional tray. 1... IC1 2... Tray 3... Hole, 4... Contact for electrical property testing, 5... IC lead, 6... Stand, 7... Pusher
Claims (1)
合わせた穴を有することを特徴とするＩＣ製造用トレー
。A tray for IC manufacturing, which is used in an IC manufacturing process and is characterized by having holes that match IC leads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63277844A JPH02122645A (en) | 1988-11-01 | 1988-11-01 | Tray for manufacturing ic |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63277844A JPH02122645A (en) | 1988-11-01 | 1988-11-01 | Tray for manufacturing ic |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02122645A true JPH02122645A (en) | 1990-05-10 |
Family
ID=17589054
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63277844A Pending JPH02122645A (en) | 1988-11-01 | 1988-11-01 | Tray for manufacturing ic |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02122645A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04277700A (en) * | 1991-02-08 | 1992-10-02 | Internatl Business Mach Corp <Ibm> | Work holder of substrate |
| WO1995034825A1 (en) * | 1994-06-15 | 1995-12-21 | Advantest Corporation | Carrier of ic handler |
| CN103879685A (en) * | 2012-12-21 | 2014-06-25 | 富士康(昆山)电脑接插件有限公司 | Electric connector support plate |
-
1988
- 1988-11-01 JP JP63277844A patent/JPH02122645A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04277700A (en) * | 1991-02-08 | 1992-10-02 | Internatl Business Mach Corp <Ibm> | Work holder of substrate |
| WO1995034825A1 (en) * | 1994-06-15 | 1995-12-21 | Advantest Corporation | Carrier of ic handler |
| US5635832A (en) * | 1994-06-15 | 1997-06-03 | Advantest Corporation | IC carrier for use with an IC handler |
| CN103879685A (en) * | 2012-12-21 | 2014-06-25 | 富士康(昆山)电脑接插件有限公司 | Electric connector support plate |
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