JPH0529522A - Hybrid integrated circuit device - Google Patents

Abstract

PURPOSE:To correct voltage drop when contact resistance of a socket and wiring resistance exist in the current path between leads arranged on a hybrid integrated circuit and an external measuring apparatus. CONSTITUTION:An insertion type lead 4 fixed to a lead pad 2 on a hybrid integrated circuit device 1 is made bifurcate, and constituted as a sense pin and a force pin.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead of a hybrid integrated circuit device.

[0002]

2. Description of the Related Art FIG. 2 shows a conventional hybrid integrated circuit device, in which 1 is a hybrid integrated circuit device and 2 is a lead pad provided on the hybrid integrated circuit device 1.
Reference numeral 3 is an insertion type lead attached to the lead pad 2.

Next, the operation will be described. The insertion type lead 3 attached to the lead pad 2 as described above is
By inserting into a socket or through-hole plate, actual operation or function inspection is performed.

[0004]

In the shape of the insertion type lead of the conventional hybrid integrated circuit device, the contact resistance of the socket into which the object to be measured is inserted and the wiring provided between the socket and the external measuring device are not provided. There is a problem that a measurement error occurs due to a voltage drop in the current path due to the influence of the resistance component.

The present invention has been made in order to solve the above problems, and it is a hybrid integrated system capable of performing a test without the influence of a voltage drop caused by a contact resistance of a socket or a wiring resistance in a current path. The purpose is to obtain a circuit device.

[0006]

In the hybrid integrated circuit device according to the present invention, the Kelvin points of the sense line and the force line are set to the object to be measured as much as possible so that the voltage drop due to the contact resistance of the socket and the wiring resistance can be corrected. In order to bring them closer to each other, the shape of the lead is bifurcated, each of which is a sense pin,
It is a four-spin.

[0007]

In the hybrid integrated circuit device according to the present invention, the leads are bifurcated, and the leads are the sense pins and the force pins, so that the contact resistance of the socket in the current path and the voltage drop due to the wiring resistance can be corrected. .

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1, 1 is a hybrid integrated circuit device, 2 is a lead pad, and a bifurcated insertion type lead 4 is attached to the lead pad 2. Then, each of the bifurcated insertion type leads 4 is used as a sense pin and a force pin, and a sense pad and a force line are Kelvin in the lead pad portion on the object to be measured.

More specifically, the lead pad 2 provided on the hybrid integrated circuit device 1 is provided with a bifurcated bifurcated insertion type lead 4 having a sense pin and a force pin, respectively. This is done in order to bring the Kelvin points of the sense line and the force line as close as possible to the object to be measured so that the voltage drop due to the contact resistance or wiring resistance of the socket in the current path can be corrected.

[0010]

As described above, according to the present invention, it is possible to correct the voltage drop due to the contact resistance of the socket and the wiring resistance by making the lead shape bifurcated and forming the sense pin and the force pin, respectively.

[Brief description of drawings]

FIG. 1 is a configuration diagram of a hybrid integrated circuit device according to an embodiment of the present invention.

FIG. 2 is a configuration diagram showing a conventional hybrid integrated circuit device.

[Explanation of symbols]

 1 hybrid integrated circuit device 2 lead pad 4 bifurcated insertion type lead

Claims (1)

Claim: What is claimed is: 1. A hybrid integrated circuit device having an insertion type lead, wherein the shape of the lead is bifurcated, and each of them is set to a sense pin and a force pin. .