JPH0237683A - Socket for measuring semiconductor device - Google Patents

Abstract

PURPOSE:To accurately contact a lead with a contact pin by supporting a guide plate which determines the positions of a lead of a semiconductor device and a contact pin of a measuring socket above the contact pin with a spring. CONSTITUTION:A guide plate set on a contact pin 1 by spring 2 is set supported on the contact pin 1 of a socket for measuring a semiconductor device by the spring 2. A semiconductor device to be measured 4 adsorbed by a vacuum pad 5 is made to fall in a positioning frame of the guide plate when the center of the vacuum pad 5 almost agrees with the center of the guide plate 3. After the semiconductor device to be measured 4 is thus accurately positioned by use of the positioning frame of the guide plate 3, it is inserted in the socket for measuring the semiconductor device by means of a lead presser 6, so that a lead 4a comes into accurate contact with the contact pin 1 and a test measurement can be conducted under a good condition.

Description

[Detailed Description of the Invention] [Summary] Regarding an improvement in the structure of a semiconductor device measurement socket that enables accurate positioning of a semiconductor device under test, the leads of the semiconductor device under test and the contact pins of the semiconductor device measurement socket are connected. In order to provide a semiconductor device measurement socket that can be accurately positioned, a guide plate that accurately positions the lead position of the semiconductor device to be measured and the contact pin position of the measurement socket is attached to the contact pin. It is configured to be supported above by a spring.

[Industrial application field]

The present invention relates to a semiconductor device measurement socket, and more particularly to an improvement in the structure of a semiconductor device measurement socket that enables accurate positioning of a semiconductor device to be measured.

In order to test a semiconductor device in the final testing process of the semiconductor device, the leads of the semiconductor device are brought into contact with the contact pins of the semiconductor device measurement socket, which serves as a signal relay between the semiconductor device and the measurement test equipment. Sockets for measuring semiconductor devices are used.

When inserting a semiconductor device under test into such a semiconductor device measurement socket, the leads of the semiconductor device under test and the contact pins of the semiconductor device measurement socket must be accurately aligned.

In the unlikely event that this alignment is insufficient, accurate measurement may not be possible due to poor contact between the leads of the semiconductor device under test and the contact pins of the semiconductor device measurement socket due to misalignment. The leads of the semiconductor device under test and the contact pins of the measurement socket may cause interference.
The lead is bent, etc.

Under the above circumstances, there is a need for a semiconductor device measurement socket that can accurately align the leads of the semiconductor device to be measured and the contact pins of the semiconductor device measurement socket.

[Conventional technology]

A conventional semiconductor device measurement socket for a quad flat package type semiconductor device will be explained with reference to FIGS. 3 and 4.

When testing a QFP type (hereinafter abbreviated as QFP type) semiconductor device, which has a complex structure among semiconductor devices, as shown in Figure 3, this semiconductor The device has leads protruding in all directions, and the lead width and lead spacing are very small, making it difficult to accurately align and insert the semiconductor device into a semiconductor device measurement socket.

In the conventional semiconductor device measurement socket for a QFP semiconductor device shown in a perspective view in FIG. 4, if the leads of the semiconductor device under test and the contact pins of the semiconductor device measurement socket become misaligned, Due to misalignment, accurate measurements cannot be made due to poor contact between the leads of the semiconductor device under test and the contact pins of the semiconductor device measurement socket. Interference occurs with the contact pins of the socket, resulting in appearance defects such as bent leads.

[Problem to be solved by the invention]

In the conventional semiconductor device measurement socket described above, the leads of the semiconductor device under test protrude in all directions, and the lead width and lead spacing are very small. The problem is that it is difficult to accurately align and insert the contact pins of the semiconductor device, and in the event of misalignment, the leads of the semiconductor device and the socket for measuring the semiconductor device may be damaged due to the misalignment. Accurate measurements cannot be made due to poor contact with the contact pins, and interference occurs between the leads of the semiconductor device under test and the contact pins of the semiconductor device measurement socket, resulting in external defects such as bent leads. In addition, if the semiconductor device itself has bent leads or cracks in the package, the leads of the semiconductor device under test and the contact pins of the measurement socket may interfere, making it difficult to take out the semiconductor device under test using the vacuum band. The problem was that it was difficult.

In view of the above-mentioned circumstances, it is an object of the present invention to provide a socket for measuring a semiconductor device that can accurately position the leads of a semiconductor device to be measured and the contact pins of the socket for measuring a semiconductor device.

(Means for Solving the Problem) The above problem is such that the guide plate for accurately positioning the lead position of the semiconductor device under test and the contact pin position of the measurement socket is placed above the contact pin.
This problem is solved by the semiconductor device measuring socket I- according to the present invention, which is supported by a spring.

[Effect]

That is, in the present invention, a guide plate is provided above the contact pins of the measurement socket and is supported by a spring to accurately position the leads of the semiconductor device under test and the contact pins of the semiconductor device measurement socket. Therefore, by placing the semiconductor device under test on this guide plate and lowering it by applying downward force, the leads of the semiconductor device under test and the contact pin of the semiconductor device measurement socket will come into precise contact, ensuring reliability. This makes it possible to test and measure a highly sensitive semiconductor device under test.

〔Example〕

The case of a Q, FP type semiconductor device according to an embodiment of the present invention will be explained below with reference to FIGS. 1 and 2.

In the semiconductor device measuring socket of the present invention, as shown in FIG. 1, a guide plate 3 is provided on a contact bin 1 by a spring 2 (not shown).

As shown in FIG. 2 (al), the guide plate 3 is provided with the semiconductor H7 supported by a spring 2 on the contact bin 1 of the measurement socket, and the semiconductor device to be measured is attracted by the vacuum pad 5. 4. For example, a QFP type semiconductor device is transported above this guide plate 3 as shown in the figure.

Next, as shown in FIG. 2(b), when the center of the vacuum pad 5 and the center of the guide plate 3 almost coincide, the vacuum of the vacuum pad 5 is released and the QFP semiconductor device is moved into the positioning frame of the guide plate 3. be dropped into.

The guide plate 3 and the QFP semiconductor device are accurately positioned by a positioning frame provided on the guide plate 3 that matches the package outline of the QFP semiconductor device.

When the QFP type semiconductor device is accurately positioned by this frame, as shown in FIG. The QFP type semiconductor device is tested and measured by crimping it onto the contact pin 1 of the QFP semiconductor device.

In this way, the semiconductor device under test 4 is placed on the guide plate 3 in advance.
After accurate positioning using the positioning frame, place the semiconductor under test H
Since the lead 4a of the semiconductor device under test 4 is inserted into the socket for semiconductor device measurement using the lead holder 6, the lead 4a of the semiconductor device under test 4 and the contact bottle 1 of the semiconductor device measurement socket are properly contacted, and the test measurement of the semiconductor device under test 4 is performed. can be carried out in good condition.

〔Effect of the invention〕

As is clear from the above description, according to the present invention, a guide plate with a very simple structure is provided above the contact pins of a semiconductor device measurement socket, and the leads of the semiconductor device under test and the semiconductor device measurement socket are connected. Since the semiconductor device under test is inserted into the measurement socket after positioning the contact bin, it is possible to prevent poor contact between the leads and the contact bin and interference between the leads and the contact bin due to misalignment. Even if there is any interference between the leads and the contact bin, the force of the spring 2 will push up the guide plate, making it possible to smoothly remove the semiconductor device under test from the measurement socket using a vacuum pad. It has the following advantages, and can be expected to have significant economical and reliability-improving effects, making it extremely useful industrially.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing one embodiment of the present invention, FIG. 2 is a side sectional view showing the operating state of one embodiment of the present invention, FIG. 3 is a diagram showing the shape of a QFP type semiconductor device, and FIG. The figure is a perspective view showing a conventional semiconductor device measurement socket. In the figure, 1 is a contact pin, 2 is a spring, 3 is a guide plate, 4 is a semiconductor device to be measured, 4a is a lead, 5 is a vacuum pad, and 6 is a lead holder. Shukunoube

Claims (1)

[Claims] A guide plate (3) for accurately positioning the lead (4a) of the semiconductor device under test (4) and the contact pin (1) of the measurement socket is mounted above the contact pin (1) with a spring. A socket for measuring a semiconductor device, characterized in that it is supported by (2).