JPS6252664B2 - - Google Patents
Info
- Publication number
- JPS6252664B2 JPS6252664B2 JP56135184A JP13518481A JPS6252664B2 JP S6252664 B2 JPS6252664 B2 JP S6252664B2 JP 56135184 A JP56135184 A JP 56135184A JP 13518481 A JP13518481 A JP 13518481A JP S6252664 B2 JPS6252664 B2 JP S6252664B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- bonding
- ceramic coating
- solder flux
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 4
- 230000020169 heat generation Effects 0.000 claims description 2
- 238000003672 processing method Methods 0.000 claims description 2
- 238000002485 combustion reaction Methods 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 238000005524 ceramic coating Methods 0.000 description 25
- 229910000679 solder Inorganic materials 0.000 description 21
- 230000004907 flux Effects 0.000 description 18
- 238000010438 heat treatment Methods 0.000 description 8
- 239000004020 conductor Substances 0.000 description 5
- 238000001514 detection method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13518481A JPS5835936A (ja) | 1981-08-28 | 1981-08-28 | ボンデイングチツプの処理方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13518481A JPS5835936A (ja) | 1981-08-28 | 1981-08-28 | ボンデイングチツプの処理方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5835936A JPS5835936A (ja) | 1983-03-02 |
JPS6252664B2 true JPS6252664B2 (de) | 1987-11-06 |
Family
ID=15145794
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13518481A Granted JPS5835936A (ja) | 1981-08-28 | 1981-08-28 | ボンデイングチツプの処理方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5835936A (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20210075883A (ko) | 2019-12-13 | 2021-06-23 | 오토노머스 메디컬 디바이시스 인코포레이티드 | 자동화된 클라우드-기반 현장현시(poc) 병원체 및 항체 어레이 검출 시스템 및 방법 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60140894A (ja) * | 1983-12-28 | 1985-07-25 | 富士通株式会社 | 細線の接続方法 |
JPS60254585A (ja) * | 1984-05-31 | 1985-12-16 | 富士通株式会社 | 通電加熱電極の構造 |
JP6089193B2 (ja) * | 2015-05-19 | 2017-03-08 | 株式会社アンド | 半田処理装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55119183A (en) * | 1979-03-08 | 1980-09-12 | Nippon Steel Corp | Cleaning of steel plate surface by laser irradiation |
-
1981
- 1981-08-28 JP JP13518481A patent/JPS5835936A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55119183A (en) * | 1979-03-08 | 1980-09-12 | Nippon Steel Corp | Cleaning of steel plate surface by laser irradiation |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20210075883A (ko) | 2019-12-13 | 2021-06-23 | 오토노머스 메디컬 디바이시스 인코포레이티드 | 자동화된 클라우드-기반 현장현시(poc) 병원체 및 항체 어레이 검출 시스템 및 방법 |
Also Published As
Publication number | Publication date |
---|---|
JPS5835936A (ja) | 1983-03-02 |
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