JPS6252664B2 - - Google Patents

Info

Publication number
JPS6252664B2
JPS6252664B2 JP56135184A JP13518481A JPS6252664B2 JP S6252664 B2 JPS6252664 B2 JP S6252664B2 JP 56135184 A JP56135184 A JP 56135184A JP 13518481 A JP13518481 A JP 13518481A JP S6252664 B2 JPS6252664 B2 JP S6252664B2
Authority
JP
Japan
Prior art keywords
chip
bonding
ceramic coating
solder flux
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56135184A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5835936A (ja
Inventor
Mineo Yamagishi
Masaji Saiki
Nobuo Sasagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP13518481A priority Critical patent/JPS5835936A/ja
Publication of JPS5835936A publication Critical patent/JPS5835936A/ja
Publication of JPS6252664B2 publication Critical patent/JPS6252664B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP13518481A 1981-08-28 1981-08-28 ボンデイングチツプの処理方法 Granted JPS5835936A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13518481A JPS5835936A (ja) 1981-08-28 1981-08-28 ボンデイングチツプの処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13518481A JPS5835936A (ja) 1981-08-28 1981-08-28 ボンデイングチツプの処理方法

Publications (2)

Publication Number Publication Date
JPS5835936A JPS5835936A (ja) 1983-03-02
JPS6252664B2 true JPS6252664B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1987-11-06

Family

ID=15145794

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13518481A Granted JPS5835936A (ja) 1981-08-28 1981-08-28 ボンデイングチツプの処理方法

Country Status (1)

Country Link
JP (1) JPS5835936A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210075883A (ko) 2019-12-13 2021-06-23 오토노머스 메디컬 디바이시스 인코포레이티드 자동화된 클라우드-기반 현장현시(poc) 병원체 및 항체 어레이 검출 시스템 및 방법

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60140894A (ja) * 1983-12-28 1985-07-25 富士通株式会社 細線の接続方法
JPS60254585A (ja) * 1984-05-31 1985-12-16 富士通株式会社 通電加熱電極の構造
JP6089193B2 (ja) * 2015-05-19 2017-03-08 株式会社アンド 半田処理装置
JP6818262B2 (ja) * 2016-03-11 2021-01-20 株式会社アンド 半田付け装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55119183A (en) * 1979-03-08 1980-09-12 Nippon Steel Corp Cleaning of steel plate surface by laser irradiation

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210075883A (ko) 2019-12-13 2021-06-23 오토노머스 메디컬 디바이시스 인코포레이티드 자동화된 클라우드-기반 현장현시(poc) 병원체 및 항체 어레이 검출 시스템 및 방법

Also Published As

Publication number Publication date
JPS5835936A (ja) 1983-03-02

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