JPS6252451B2 - - Google Patents
Info
- Publication number
- JPS6252451B2 JPS6252451B2 JP16383178A JP16383178A JPS6252451B2 JP S6252451 B2 JPS6252451 B2 JP S6252451B2 JP 16383178 A JP16383178 A JP 16383178A JP 16383178 A JP16383178 A JP 16383178A JP S6252451 B2 JPS6252451 B2 JP S6252451B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- insulating plate
- capacitor element
- resistant insulating
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 239000011810 insulating material Substances 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000003990 capacitor Substances 0.000 description 45
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 18
- 229910000679 solder Inorganic materials 0.000 description 12
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 239000007787 solid Substances 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 238000007747 plating Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000007784 solid electrolyte Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16383178A JPS5586111A (en) | 1978-12-22 | 1978-12-22 | Chip type electronic part and method of fabricating same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16383178A JPS5586111A (en) | 1978-12-22 | 1978-12-22 | Chip type electronic part and method of fabricating same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5586111A JPS5586111A (en) | 1980-06-28 |
| JPS6252451B2 true JPS6252451B2 (ko) | 1987-11-05 |
Family
ID=15781567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16383178A Granted JPS5586111A (en) | 1978-12-22 | 1978-12-22 | Chip type electronic part and method of fabricating same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5586111A (ko) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6094820U (ja) * | 1983-12-05 | 1985-06-28 | 関西日本電気株式会社 | 固体電解コンデンサ |
| JP4590811B2 (ja) * | 2000-09-26 | 2010-12-01 | 日本ケミコン株式会社 | チップ型固体電解コンデンサ |
| JP2002203748A (ja) * | 2000-12-28 | 2002-07-19 | Nippon Chemicon Corp | チップ型固体電解コンデンサおよびその製造方法 |
| JP2002367862A (ja) * | 2001-04-05 | 2002-12-20 | Rohm Co Ltd | 固体電解コンデンサおよびその製造方法 |
| JP5017164B2 (ja) * | 2008-04-16 | 2012-09-05 | Ｎｅｃトーキン株式会社 | 固体電解コンデンサ |
| JP2010087241A (ja) * | 2008-09-30 | 2010-04-15 | Sanyo Electric Co Ltd | 固体電解コンデンサ |
-
1978
- 1978-12-22 JP JP16383178A patent/JPS5586111A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5586111A (en) | 1980-06-28 |
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