JPS6252451B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a chip-type electronic component and a method for manufacturing the same, and more particularly to an electrode structure of a chip-type solid electrolytic capacitor and a method for manufacturing the same.

As a conventional chip type solid electrolytic capacitor,
As shown in Fig. 1, the capacitor element 1 has a sealed structure with a molded resin 3 in which the entire capacitor element 1 is externally covered with transfer molding, and as shown in Fig. 2, the capacitor element 1 has a solder layer 2
It is broadly classified into those with a structure coated with a conductive material such as.

The former type with a transfer molded exterior has the advantage of having a sealed structure with molded resin 3, which reduces the deterioration of electrical characteristics over time, as well as high dimensional accuracy and high mechanical strength. Since it requires a lot of manufacturing equipment such as element assembly and molding machines, it cannot be manufactured industrially at low cost. Another drawback was that it was not possible to downsize it due to its structure.

On the other hand, the latter, which has a conductive material covering structure in which the capacitor element 1 is covered with a solder layer 2, has good volumetric efficiency and can be miniaturized, and has the advantage that it can be mass-produced at a lower cost than the former molded resin sealed structure. However, the mechanical strength of the lead-out part of the anode lead wire 4 and the connection part 6 of the anode lead wire 4 with the anode terminal 5 is weak, and there are disadvantages in handling stages such as packaging and transportation. Since all but layer 2 is exposed, electrical characteristics such as moisture resistance deteriorate, and since the solder layer 2, which serves as a cathode terminal, is configured to be directly mounted on a hybrid IC board, etc. If the temperature is too high or if it takes a long time, deterioration of the electrical characteristics cannot be avoided.

Therefore, in order to eliminate these drawbacks, the capacitor element 1 is connected on a heat-resistant insulating plate 8 having a pair of through holes 7 as shown in FIG. Figure 3b coated
The structure shown appeared. The structure shown in FIG. 3b is smaller than the transfer-a-molded structure shown in FIG. 1, and the anode lead wire 4 of the structure shown in FIG. The drawbacks of deterioration of electrical characteristics such as mechanical strength and moisture resistance of the lead-out part and the anode terminal 5 and connection part 6 of the anode lead wire 4 are improved by coating the capacitor element 1 with the exterior resin 3. However, the structure of the electrode terminal 10 is such that the capacitor element 1 is fixed on a heat-resistant insulating plate 8 with an exterior resin 9, and the electrode part 10 is immersed in a molten solder layer.
Since the structure of the cathode part is almost the same as that shown in Fig. 2, in which the capacitor element 1 is covered with the solder layer 2, it may become hot when mounted on a hybrid IC board, etc. If it is too long or takes a long time, the electrical characteristics will deteriorate and the electrode terminal 10
It is difficult to control the amount of solder in each part to a constant amount.
If the amount of solder is small, the solder in the through hole 7 will melt and flow onto the electrode pattern of the hybrid IC board, etc., and the solder shape of the electrode terminal 10 connecting the capacitor element 1 and the hybrid IC board, etc. will be in the form of a thin line. become,
If the connection strength after mounting becomes weak, or in extreme cases, all the solder on the capacitor electrode terminal 10 becomes a hybrid IC.
There is a drawback that the current flows onto the circuit board or the like, causing a short circuit between the capacitor element 1 and the hybrid IC board or the like.

Furthermore, in manufacturing, the connection of the capacitor element 1 onto the heat-resistant insulating plate 8 and the coating of the outer resin 9 on the circumferential surface of the capacitor element 1 are handled for each capacitor element, requiring a huge number of man-hours.

An object of the present invention is to eliminate these conventional drawbacks and provide a chip-type electronic component suitable for mass production and a method for manufacturing the same.

The present invention electrically connects an electronic component element electrode between both ends of the same side surface of a conductive region, which is provided on both ends of a heat-resistant insulating plate so that the upper surface and the lower surface are electrically connected. It is characterized in that the peripheral surface of the component element is coated with an insulating material.

Furthermore, in the production of a capacitor having the above structure, the present invention provides an electrical connection between the ends of the same side of a conductive region whose upper and lower surfaces are connected to both ends of a strip-shaped heat-resistant insulating plate by through-hole plating. connected to the electronic component, and coated with insulating material around the electronic component element
It is characterized in that it is manufactured by cutting the band-shaped heat-resistant insulating plate, the conductive region, and the insulating material at a location away from the electronic component element.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a chip-type electronic component according to the present invention will be described with reference to the drawings regarding the structure and manufacturing method of a chip-type solid electrolytic capacitor.

FIGS. 4 and 5 show the manufacturing process of an embodiment of the present invention. As shown in FIG. After shaping and sintering, the anode lead wires 4 are connected to the band-shaped fixed metal plate 11 at regular intervals by welding, etc. In this state, the capacitor element 1 is anodized, and the surface of the dielectric oxide film generated at this time is coated with dioxide. It is made by depositing a solid electrolyte such as manganese, and then sequentially depositing a carbon layer and a conductive layer (conductive silver paint or conductive adhesive) by a known method. Next, connect the anode auxiliary lead wire 12 to the anode lead wire 4 by welding or the like, cut the anode lead wire 4 at the position of the chain line x-x', and then connect the fixed metal plate 1.
Separate 1.

On the other hand, the board to which the capacitor element 1 is fixedly connected is
As shown in FIG. 4b, conductive regions 14a, 14b, 15a, and 15b are formed on both ends of a strip-shaped heat-resistant insulating substrate 13 made of epoxy glass or the like, and conductive regions 14a, 14b, 15a, and 15b are through holes. The upper and lower surfaces are electrically connected through plating holes 16, respectively. Conductive regions 14a, 14
Conductive regions 14a, 14b and 15a formed by formation of b, 15a, 15b and through-hole plating hole 16
As for the connection method between 15b and 15b, it can be easily manufactured by using known techniques such as etching of a printed wiring board and through-hole plating process.

Band-shaped heat-resistant insulating plate 13 obtained in this way
The capacitor element 1 and the anode auxiliary lead wire 12 are connected to the upper surface of the capacitor and the conductive regions 14a and 15a using a conductive adhesive 17 so as to correspond to the through-hole plating holes 16, as shown in FIG. 4c. After that, the capacitor element 1 is immersed in an insulating material such as epoxy resin with the exposed surface facing downward, and the exterior resin 9 is coated on the circumferential surface of the capacitor element 1 as shown in FIG. By cutting with a cutter or the like, a chip-type solid electrolytic capacitor having a structure in which electrode terminals 14b and 15b are used as shown in FIGS. 5a and 5b can be obtained. In addition, when cutting along the chain line Y--Y', it is easy to cut the capacitor elements 1 by cutting along the chain line Y--Y', with a plurality of capacitor elements 1 as one block.
A chip-type block solid electrolytic capacitor in which a plurality of capacitor elements are combined is obtained.

In the above embodiment, (a) the conductive adhesive 17 was used to connect the band-shaped heat-resistant insulating plate, the capacitor element 1, and the anode auxiliary lead wire 12, but it is also possible to use a connection method such as soldering or welding. Of course, this is a good thing.

(b) Band-shaped heat-resistant insulating plate 13 conductive regions 14a, 15
a, capacitor element 1 and anode auxiliary lead wire 1
Another method for connecting to the anode lead wire 2 is to connect the anode auxiliary lead wire 1 to the anode lead wire 4 in the process after forming the carbon layer in the process of forming the capacitor element 1.
2, cut the anode lead wire 4 at the point X-X' to separate the fixed metal plate 11, then immerse the capacitor element 1 in a conductive solution such as conductive adhesive, and then connect the anode auxiliary lead wire 12 in a conductive solution and before curing the conductive adhesive etc.
A connection method may also be used in which the conductive regions 14a and 15a of the band-shaped heat-resistant insulating plate are installed in the same state, and then the conductive adhesive or the like is cured to completely connect and fix the conductive adhesive.

(c) In FIGS. 4b and 4c, the conductive regions 14a and 14b and 15a and 15b on both sides of the strip-shaped heat-resistant insulating plate 13 are arranged for each capacitor element 1.
Although the connection is shown using two through-hole holes 16, the connection may be made using a plurality of through-hole holes 16 in order to increase the reliability of the connection.

(d) In FIG. 4b, conductive regions 14a, 14b,
Although the widths of 15a and 15b are shown to be the same, they do not need to be the same, and can be freely selected depending on the size of the capacitor element 1 and other needs.

(E) If a magnetic material such as iron or nickel is used as the anode auxiliary lead wire 12, polarity can be determined based on magnetism.

As described above, according to the present invention, a plurality of capacitor elements can be simultaneously connected to external electrodes and covered with resin. Furthermore, the heat generated during soldering when mounting a capacitor element on a hybrid IC board, etc. is transmitted to the capacitor element via a heat-resistant insulating plate, so electrical characteristics may deteriorate due to temperature and time during mounting. has been significantly improved. Therefore, if the present invention is used, a chip-type solid electrolytic capacitor with stable electrical characteristics that can be mass-produced with a small number of man-hours can be obtained, which is of great industrial value.

[Brief explanation of the drawing]

Figure 1 is a side view of a conventional chip-type solid electrolytic capacitor with a transfer mold structure. FIG. 2 is a side view of a chip-type solid electrolytic capacitor having a structure in which a conventional capacitor element is coated with solder. 3a and 3b are cross-sectional views of a conventional heat-resistant insulating plate and a chip-type solid electrolytic capacitor having a structure using the heat-resistant insulating plate. Fourth
Figures a, b, c, and d are perspective views showing the manufacturing process of the present invention and a strip-shaped heat-resistant insulating plate according to the present invention. FIGS. 5a and 5b are a perspective view and a sectional view of a chip-type solid electrolytic capacitor according to the present invention. Symbols in the figure: 1...Capacitor element, 2...Solder layer, 3...Mold resin, 4...Anode lead wire, 5...
Anode terminal, 6... Connection part, 7... Through hole, 8... Heat-resistant insulating plate, 9... Exterior resin, 10... Electrode part, 11... Fixed metal plate, 12... Anode auxiliary lead wire, 13... Band-shaped heat-resistant insulating plate , 14a, 14b, 15a, 15b
...Conductive region, 16...Through hole plating hole, 17...
conductive adhesive.

Claims (1)

[Scope of Claims] 1. A heat-resistant insulating plate having a conductor on both sides of one side and the other side opposite thereto, the upper and lower surfaces of which are electrically connected, and between both ends of one side of the conductor. A chip type characterized in that both electrodes of the electronic component element are electrically connected to each other so that the heat-resistant insulating plate is provided on the entire lower surface of the electronic component element, and the electronic component element is covered with an insulating material. electronic components. 2 Both electrodes of a plurality of electronic component elements are electrically connected between both ends of one surface of a conductive region whose upper surface and lower surface are electrically connected to both ends of the strip-shaped heat-resistant insulating plate facing each other in the short side direction. 1. A method for manufacturing a chip-type electronic component, comprising the steps of: connecting the electronic component element to the electronic component element; coating the electronic component element with an insulating material; and cutting and separating each of the electronic component elements.