JPS6251500B2 - - Google Patents

Info

Publication number
JPS6251500B2
JPS6251500B2 JP56173749A JP17374981A JPS6251500B2 JP S6251500 B2 JPS6251500 B2 JP S6251500B2 JP 56173749 A JP56173749 A JP 56173749A JP 17374981 A JP17374981 A JP 17374981A JP S6251500 B2 JPS6251500 B2 JP S6251500B2
Authority
JP
Japan
Prior art keywords
lead wire
alloy
film
circuit element
plating film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56173749A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5875861A (ja
Inventor
Katsumi Ishii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Denka Inc
Original Assignee
Fuji Denka Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Denka Inc filed Critical Fuji Denka Inc
Priority to JP17374981A priority Critical patent/JPS5875861A/ja
Publication of JPS5875861A publication Critical patent/JPS5875861A/ja
Publication of JPS6251500B2 publication Critical patent/JPS6251500B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP17374981A 1981-10-30 1981-10-30 回路素子気密パツケ−ジ用リ−ド線及びその製造方法 Granted JPS5875861A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17374981A JPS5875861A (ja) 1981-10-30 1981-10-30 回路素子気密パツケ−ジ用リ−ド線及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17374981A JPS5875861A (ja) 1981-10-30 1981-10-30 回路素子気密パツケ−ジ用リ−ド線及びその製造方法

Publications (2)

Publication Number Publication Date
JPS5875861A JPS5875861A (ja) 1983-05-07
JPS6251500B2 true JPS6251500B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1987-10-30

Family

ID=15966413

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17374981A Granted JPS5875861A (ja) 1981-10-30 1981-10-30 回路素子気密パツケ−ジ用リ−ド線及びその製造方法

Country Status (1)

Country Link
JP (1) JPS5875861A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6439598U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1987-08-31 1989-03-09

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS603144A (ja) * 1983-06-21 1985-01-09 Oki Electric Ind Co Ltd 半導体パツケ−ジのリ−ド処理方法
JP2674788B2 (ja) * 1988-07-26 1997-11-12 松下電工株式会社 半導体パッケージの端子ピン
JP2674789B2 (ja) * 1988-07-26 1997-11-12 松下電工株式会社 端子ピン付き基板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7308700A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1973-06-22 1974-12-24

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6439598U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1987-08-31 1989-03-09

Also Published As

Publication number Publication date
JPS5875861A (ja) 1983-05-07

Similar Documents

Publication Publication Date Title
US4542259A (en) High density packages
KR100318818B1 (ko) 리드프레임에대한보호피막결합
JPS60257160A (ja) 半導体装置
US5122858A (en) Lead frame having polymer coated surface portions
US4441118A (en) Composite copper nickel alloys with improved solderability shelf life
US6087712A (en) Lead frame containing leads plated with tin alloy for increased wettability and method for plating the leads
EP1037277B1 (en) Lead frame and method of fabricating a lead frame
JPS6251500B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
US5935719A (en) Lead-free, nickel-free and cyanide-free plating finish for semiconductor leadframes
JP2596542B2 (ja) リードフレームおよびそれを用いた半導体装置
JPS5916353A (ja) リ−ドフレ−ム
KR20010049673A (ko) 도금된 전자 성단을 제조하는 방법
JPS6060742A (ja) リ−ドフレ−ム
JPS60241241A (ja) 半導体装置
JPS6232622B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH0519820B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS60147146A (ja) 半導体用リ−ドフレ−ム
JPS6178150A (ja) 樹脂封止型半導体装置用リ−ドフレ−ム
JPS6214452A (ja) 半導体用リ−ドフレ−ム
JPH0567069B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP2001015666A (ja) 半導体装置及びその製造方法
JPS62213270A (ja) 半導体装置用リ−ドフレ−ム
JP2743567B2 (ja) 樹脂封止型集積回路
JPS6210939Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS6097651A (ja) 半導体装置