JPS6249983B2 - - Google Patents

Info

Publication number
JPS6249983B2
JPS6249983B2 JP2240680A JP2240680A JPS6249983B2 JP S6249983 B2 JPS6249983 B2 JP S6249983B2 JP 2240680 A JP2240680 A JP 2240680A JP 2240680 A JP2240680 A JP 2240680A JP S6249983 B2 JPS6249983 B2 JP S6249983B2
Authority
JP
Japan
Prior art keywords
bonding
bonding tool
prism
electrodes
slope
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP2240680A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56118346A (en
Inventor
Junji Imai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2240680A priority Critical patent/JPS56118346A/ja
Publication of JPS56118346A publication Critical patent/JPS56118346A/ja
Publication of JPS6249983B2 publication Critical patent/JPS6249983B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP2240680A 1980-02-25 1980-02-25 Gang bonding device Granted JPS56118346A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2240680A JPS56118346A (en) 1980-02-25 1980-02-25 Gang bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2240680A JPS56118346A (en) 1980-02-25 1980-02-25 Gang bonding device

Publications (2)

Publication Number Publication Date
JPS56118346A JPS56118346A (en) 1981-09-17
JPS6249983B2 true JPS6249983B2 (enrdf_load_stackoverflow) 1987-10-22

Family

ID=12081777

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2240680A Granted JPS56118346A (en) 1980-02-25 1980-02-25 Gang bonding device

Country Status (1)

Country Link
JP (1) JPS56118346A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2592337B2 (ja) * 1989-11-20 1997-03-19 株式会社カイジョー テープボンディング方法

Also Published As

Publication number Publication date
JPS56118346A (en) 1981-09-17

Similar Documents

Publication Publication Date Title
US4615093A (en) Method and an apparatus for the positioning of components with reference to a workpiece
CN106559977B (zh) 用于在衬底上安装部件的装置
JPH02244649A (ja) 整列／接合装置及び方法
KR102799880B1 (ko) 레이저 가공 장치
JP2011066041A (ja) 電子部品実装装置
US20020003997A1 (en) Manipulator/end effector head for robotic assembly
JPS6249983B2 (enrdf_load_stackoverflow)
US6266891B1 (en) Method of and apparatus for bonding component
JP2004128384A (ja) 部品実装装置および部品実装方法
CN212646510U (zh) 晶圆位错自动检测仪
CN216528811U (zh) 一种贴装装置及定位装置
JPS61159312A (ja) 穿孔装置
JPH08201430A (ja) プローバのアライメント方法及び装置
JP3369695B2 (ja) 電子部品位置合せ用カメラの調整装置
JP3075854B2 (ja) 部品のリード浮き検出方法及びそれを使用した部品装着装置
WO2004112100A1 (de) Bondvorrichtung und bondverfahren
JPH0131296B2 (enrdf_load_stackoverflow)
JPS6144305A (ja) 半導体チツプの回転位置補正方法
KR20000032388A (ko) 평면브라운관 제조용 마스크/패널 접합장치
JPS61207904A (ja) 穿孔装置による穿設孔の検査方法
JPH03263338A (ja) インナーリードボンディング装置
GB1592368A (en) Automated manipulative operation system
KR940007536B1 (ko) 범프 부착방법
JPH0645652A (ja) 光学ヘッドのダイボンディング装置及びダイボンディング方法
CN117457560A (zh) 一种带有系统误差补偿功能的键合装置以及方法