JPS6248899B2 - - Google Patents

Info

Publication number
JPS6248899B2
JPS6248899B2 JP56084025A JP8402581A JPS6248899B2 JP S6248899 B2 JPS6248899 B2 JP S6248899B2 JP 56084025 A JP56084025 A JP 56084025A JP 8402581 A JP8402581 A JP 8402581A JP S6248899 B2 JPS6248899 B2 JP S6248899B2
Authority
JP
Japan
Prior art keywords
photoresist
plating
wiring pattern
forming
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56084025A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57198648A (en
Inventor
Hiromichi Kono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP56084025A priority Critical patent/JPS57198648A/ja
Publication of JPS57198648A publication Critical patent/JPS57198648A/ja
Publication of JPS6248899B2 publication Critical patent/JPS6248899B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Electroplating Methods And Accessories (AREA)
JP56084025A 1981-06-01 1981-06-01 Manufacture of semiconductor device Granted JPS57198648A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56084025A JPS57198648A (en) 1981-06-01 1981-06-01 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56084025A JPS57198648A (en) 1981-06-01 1981-06-01 Manufacture of semiconductor device

Publications (2)

Publication Number Publication Date
JPS57198648A JPS57198648A (en) 1982-12-06
JPS6248899B2 true JPS6248899B2 (enrdf_load_stackoverflow) 1987-10-16

Family

ID=13819011

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56084025A Granted JPS57198648A (en) 1981-06-01 1981-06-01 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS57198648A (enrdf_load_stackoverflow)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2613759C3 (de) * 1976-03-31 1981-01-15 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zum Herstellen eines mehrschichtigen MetaUanschluBkontaktes für ein Halbleiterbauelement
JPS52128059A (en) * 1976-04-20 1977-10-27 Nec Corp Manufacture of semiconductor device

Also Published As

Publication number Publication date
JPS57198648A (en) 1982-12-06

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