JPS6248383B2 - - Google Patents

Info

Publication number
JPS6248383B2
JPS6248383B2 JP57144487A JP14448782A JPS6248383B2 JP S6248383 B2 JPS6248383 B2 JP S6248383B2 JP 57144487 A JP57144487 A JP 57144487A JP 14448782 A JP14448782 A JP 14448782A JP S6248383 B2 JPS6248383 B2 JP S6248383B2
Authority
JP
Japan
Prior art keywords
metal
short
package
package base
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57144487A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5933853A (ja
Inventor
Seiichi Nishino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP14448782A priority Critical patent/JPS5933853A/ja
Publication of JPS5933853A publication Critical patent/JPS5933853A/ja
Publication of JPS6248383B2 publication Critical patent/JPS6248383B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP14448782A 1982-08-19 1982-08-19 パツケ−ジおよび半導体装置の製造方法 Granted JPS5933853A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14448782A JPS5933853A (ja) 1982-08-19 1982-08-19 パツケ−ジおよび半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14448782A JPS5933853A (ja) 1982-08-19 1982-08-19 パツケ−ジおよび半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5933853A JPS5933853A (ja) 1984-02-23
JPS6248383B2 true JPS6248383B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1987-10-13

Family

ID=15363463

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14448782A Granted JPS5933853A (ja) 1982-08-19 1982-08-19 パツケ−ジおよび半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS5933853A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0198689U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1987-12-21 1989-06-30

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6130246U (ja) * 1984-07-27 1986-02-24 日本碍子株式会社 部分めつきセラミツクパツケ−ジ

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5015547A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1973-06-07 1975-02-19
JPS553821A (en) * 1978-06-22 1980-01-11 Mitsubishi Electric Corp Dehydrating treatment apparatus for sludge

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0198689U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1987-12-21 1989-06-30

Also Published As

Publication number Publication date
JPS5933853A (ja) 1984-02-23

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