JPS6246308B2 - - Google Patents

Info

Publication number
JPS6246308B2
JPS6246308B2 JP58143793A JP14379383A JPS6246308B2 JP S6246308 B2 JPS6246308 B2 JP S6246308B2 JP 58143793 A JP58143793 A JP 58143793A JP 14379383 A JP14379383 A JP 14379383A JP S6246308 B2 JPS6246308 B2 JP S6246308B2
Authority
JP
Japan
Prior art keywords
surface plate
wafer
rotational speed
polishing method
lap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58143793A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6034266A (ja
Inventor
Narikazu Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP58143793A priority Critical patent/JPS6034266A/ja
Publication of JPS6034266A publication Critical patent/JPS6034266A/ja
Publication of JPS6246308B2 publication Critical patent/JPS6246308B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP58143793A 1983-08-08 1983-08-08 研磨方法 Granted JPS6034266A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58143793A JPS6034266A (ja) 1983-08-08 1983-08-08 研磨方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58143793A JPS6034266A (ja) 1983-08-08 1983-08-08 研磨方法

Publications (2)

Publication Number Publication Date
JPS6034266A JPS6034266A (ja) 1985-02-21
JPS6246308B2 true JPS6246308B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1987-10-01

Family

ID=15347114

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58143793A Granted JPS6034266A (ja) 1983-08-08 1983-08-08 研磨方法

Country Status (1)

Country Link
JP (1) JPS6034266A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0197205U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1987-12-21 1989-06-28

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2580169B2 (ja) * 1987-05-27 1997-02-12 スピ−ドファム株式会社 加工圧制御機構付き平面研磨装置
CH684321A5 (de) * 1988-04-07 1994-08-31 Arthur Werner Staehli Einrichtung an einer Zweischeibenläppmaschine.
AU637087B2 (en) * 1989-03-24 1993-05-20 Sumitomo Electric Industries, Ltd. Apparatus for grinding semiconductor wafer

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56146665A (en) * 1980-04-14 1981-11-14 Supiide Fuamu Kk Lapping process and its device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0197205U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1987-12-21 1989-06-28

Also Published As

Publication number Publication date
JPS6034266A (ja) 1985-02-21

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