JPS6246061B2 - - Google Patents

Info

Publication number
JPS6246061B2
JPS6246061B2 JP10348283A JP10348283A JPS6246061B2 JP S6246061 B2 JPS6246061 B2 JP S6246061B2 JP 10348283 A JP10348283 A JP 10348283A JP 10348283 A JP10348283 A JP 10348283A JP S6246061 B2 JPS6246061 B2 JP S6246061B2
Authority
JP
Japan
Prior art keywords
pad
electrode pad
main electrode
auxiliary
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP10348283A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59228730A (ja
Inventor
Isamu Odaka
Haruo Yoshikyo
Katsuhiko Aoki
Yasuo Tazo
Norifumi Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NTT Inc
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP10348283A priority Critical patent/JPS59228730A/ja
Publication of JPS59228730A publication Critical patent/JPS59228730A/ja
Publication of JPS6246061B2 publication Critical patent/JPS6246061B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP10348283A 1983-06-09 1983-06-09 補助パツド付き電極パツド Granted JPS59228730A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10348283A JPS59228730A (ja) 1983-06-09 1983-06-09 補助パツド付き電極パツド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10348283A JPS59228730A (ja) 1983-06-09 1983-06-09 補助パツド付き電極パツド

Publications (2)

Publication Number Publication Date
JPS59228730A JPS59228730A (ja) 1984-12-22
JPS6246061B2 true JPS6246061B2 (OSRAM) 1987-09-30

Family

ID=14355224

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10348283A Granted JPS59228730A (ja) 1983-06-09 1983-06-09 補助パツド付き電極パツド

Country Status (1)

Country Link
JP (1) JPS59228730A (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0346352U (OSRAM) * 1989-09-13 1991-04-30

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5554940A (en) * 1994-07-05 1996-09-10 Motorola, Inc. Bumped semiconductor device and method for probing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0346352U (OSRAM) * 1989-09-13 1991-04-30

Also Published As

Publication number Publication date
JPS59228730A (ja) 1984-12-22

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