JPS6245657B2 - - Google Patents
Info
- Publication number
- JPS6245657B2 JPS6245657B2 JP10879182A JP10879182A JPS6245657B2 JP S6245657 B2 JPS6245657 B2 JP S6245657B2 JP 10879182 A JP10879182 A JP 10879182A JP 10879182 A JP10879182 A JP 10879182A JP S6245657 B2 JPS6245657 B2 JP S6245657B2
- Authority
- JP
- Japan
- Prior art keywords
- fusible alloy
- manufacturing
- strip
- shaped
- insulating case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000743 fusible alloy Inorganic materials 0.000 claims description 47
- 238000004519 manufacturing process Methods 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 7
- 238000005520 cutting process Methods 0.000 claims description 5
- 239000002131 composite material Substances 0.000 claims 2
- 238000005266 casting Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 230000004907 flux Effects 0.000 description 10
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 238000007789 sealing Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000000155 melt Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Landscapes
- Fuses (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10879182A JPS58225524A (ja) | 1982-06-24 | 1982-06-24 | 温度ヒユ−ズの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10879182A JPS58225524A (ja) | 1982-06-24 | 1982-06-24 | 温度ヒユ−ズの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58225524A JPS58225524A (ja) | 1983-12-27 |
| JPS6245657B2 true JPS6245657B2 (OSRAM) | 1987-09-28 |
Family
ID=14493567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10879182A Granted JPS58225524A (ja) | 1982-06-24 | 1982-06-24 | 温度ヒユ−ズの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58225524A (OSRAM) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59185582A (ja) * | 1983-04-07 | 1984-10-22 | Uchihashi Kinzoku Kogyo Kk | 温度ヒユ−ズ用可溶合金と電極との溶接方法 |
| JPS60246524A (ja) * | 1984-05-18 | 1985-12-06 | 水野 潤 | 温度ヒユ−ズ及びその製造方法 |
-
1982
- 1982-06-24 JP JP10879182A patent/JPS58225524A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58225524A (ja) | 1983-12-27 |
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