JPS6244989Y2 - - Google Patents
Info
- Publication number
- JPS6244989Y2 JPS6244989Y2 JP1980023141U JP2314180U JPS6244989Y2 JP S6244989 Y2 JPS6244989 Y2 JP S6244989Y2 JP 1980023141 U JP1980023141 U JP 1980023141U JP 2314180 U JP2314180 U JP 2314180U JP S6244989 Y2 JPS6244989 Y2 JP S6244989Y2
- Authority
- JP
- Japan
- Prior art keywords
- etching
- tank
- solution
- stage
- etching solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005530 etching Methods 0.000 claims description 158
- 239000007788 liquid Substances 0.000 claims description 48
- 239000000203 mixture Substances 0.000 claims description 22
- 238000001514 detection method Methods 0.000 claims description 21
- 230000032683 aging Effects 0.000 claims description 20
- 239000000126 substance Substances 0.000 claims description 10
- 238000003918 potentiometric titration Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 2
- 239000000243 solution Substances 0.000 description 56
- 230000008929 regeneration Effects 0.000 description 47
- 238000011069 regeneration method Methods 0.000 description 47
- 239000010949 copper Substances 0.000 description 15
- 238000004458 analytical method Methods 0.000 description 14
- 230000001172 regenerating effect Effects 0.000 description 13
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 9
- 229910001431 copper ion Inorganic materials 0.000 description 8
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 8
- 239000002699 waste material Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 238000004448 titration Methods 0.000 description 7
- 238000004364 calculation method Methods 0.000 description 6
- 238000000605 extraction Methods 0.000 description 5
- 229960003280 cupric chloride Drugs 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- VMQMZMRVKUZKQL-UHFFFAOYSA-N Cu+ Chemical compound [Cu+] VMQMZMRVKUZKQL-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 238000005070 sampling Methods 0.000 description 3
- 238000007599 discharging Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000007596 consolidation process Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000033116 oxidation-reduction process Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000000954 titration curve Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- ing And Chemical Polishing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980023141U JPS6244989Y2 (US20030204162A1-20031030-M00002.png) | 1980-02-26 | 1980-02-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980023141U JPS6244989Y2 (US20030204162A1-20031030-M00002.png) | 1980-02-26 | 1980-02-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56126479U JPS56126479U (US20030204162A1-20031030-M00002.png) | 1981-09-26 |
| JPS6244989Y2 true JPS6244989Y2 (US20030204162A1-20031030-M00002.png) | 1987-11-30 |
Family
ID=29619252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980023141U Expired JPS6244989Y2 (US20030204162A1-20031030-M00002.png) | 1980-02-26 | 1980-02-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6244989Y2 (US20030204162A1-20031030-M00002.png) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4243509B2 (ja) * | 2003-04-11 | 2009-03-25 | シャープ株式会社 | 薬液装置 |
| JP4706695B2 (ja) * | 2007-12-05 | 2011-06-22 | Ｔｄｋ株式会社 | 不要層のエッチング除去方法及び装置 |
| WO2013077261A1 (ja) * | 2011-11-22 | 2013-05-30 | シャープ株式会社 | 濃度管理方法および濃度管理装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS501346A (US20030204162A1-20031030-M00002.png) * | 1973-05-11 | 1975-01-08 |
-
1980
- 1980-02-26 JP JP1980023141U patent/JPS6244989Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS501346A (US20030204162A1-20031030-M00002.png) * | 1973-05-11 | 1975-01-08 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56126479U (US20030204162A1-20031030-M00002.png) | 1981-09-26 |
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