JPS6244839B2 - - Google Patents

Info

Publication number
JPS6244839B2
JPS6244839B2 JP56099722A JP9972281A JPS6244839B2 JP S6244839 B2 JPS6244839 B2 JP S6244839B2 JP 56099722 A JP56099722 A JP 56099722A JP 9972281 A JP9972281 A JP 9972281A JP S6244839 B2 JPS6244839 B2 JP S6244839B2
Authority
JP
Japan
Prior art keywords
outer shell
lead
wall surface
partial outer
partial
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56099722A
Other languages
English (en)
Japanese (ja)
Other versions
JPS582080A (ja
Inventor
Osamu Abe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIPPON DENYOO KK
Original Assignee
NIPPON DENYOO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIPPON DENYOO KK filed Critical NIPPON DENYOO KK
Priority to JP56099722A priority Critical patent/JPS582080A/ja
Publication of JPS582080A publication Critical patent/JPS582080A/ja
Publication of JPS6244839B2 publication Critical patent/JPS6244839B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Led Device Packages (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)
JP56099722A 1981-06-29 1981-06-29 Ｌｅｄランプ Granted JPS582080A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56099722A JPS582080A (ja) 1981-06-29 1981-06-29 Ｌｅｄランプ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56099722A JPS582080A (ja) 1981-06-29 1981-06-29 Ｌｅｄランプ

Publications (2)

Publication Number Publication Date
JPS582080A JPS582080A (ja) 1983-01-07
JPS6244839B2 true JPS6244839B2 (enExample) 1987-09-22

Family

ID=14254961

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56099722A Granted JPS582080A (ja) 1981-06-29 1981-06-29 Ｌｅｄランプ

Country Status (1)

Country Link
JP (1) JPS582080A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6037261U (ja) * 1983-08-22 1985-03-14 舶用電球株式会社 発光ダイオ−ドランプの発光部の放熱構造
JPS6092851U (ja) * 1983-12-01 1985-06-25 舶用電球株式会社 発光ダイオ−ドランプの発光部
EP0400176B1 (de) * 1989-05-31 2000-07-26 Osram Opto Semiconductors GmbH & Co. OHG Verfahren zum Montieren eines oberflächenmontierbaren Opto-Bauelements
US5396086A (en) * 1993-08-24 1995-03-07 Dialight Corporation LED spacer assembly
KR100537897B1 (ko) * 2001-04-26 2005-12-20 모리야마 산교 가부시키가이샤 광원연결체, 발광체장치, 패턴화도체 및 광원연결체의 제조방법
US7380961B2 (en) 2002-04-24 2008-06-03 Moriyama Sangyo Kabushiki Kaisha Light source coupler, illuminant device, patterned conductor, and method for manufacturing light source coupler

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4054814A (en) * 1975-10-31 1977-10-18 Western Electric Company, Inc. Electroluminescent display and method of making

Also Published As

Publication number Publication date
JPS582080A (ja) 1983-01-07

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