JPS6243667Y2 - - Google Patents
Info
- Publication number
- JPS6243667Y2 JPS6243667Y2 JP18524581U JP18524581U JPS6243667Y2 JP S6243667 Y2 JPS6243667 Y2 JP S6243667Y2 JP 18524581 U JP18524581 U JP 18524581U JP 18524581 U JP18524581 U JP 18524581U JP S6243667 Y2 JPS6243667 Y2 JP S6243667Y2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- substrate
- hole
- pin
- auxiliary pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 52
- 239000000758 substrate Substances 0.000 claims description 22
- 239000010410 layer Substances 0.000 claims description 10
- 238000003756 stirring Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000002344 surface layer Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 description 6
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18524581U JPS5889173U (ja) | 1981-12-12 | 1981-12-12 | 半田供給装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18524581U JPS5889173U (ja) | 1981-12-12 | 1981-12-12 | 半田供給装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5889173U JPS5889173U (ja) | 1983-06-16 |
| JPS6243667Y2 true JPS6243667Y2 (enrdf_load_stackoverflow) | 1987-11-13 |
Family
ID=29986123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18524581U Granted JPS5889173U (ja) | 1981-12-12 | 1981-12-12 | 半田供給装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5889173U (enrdf_load_stackoverflow) |
-
1981
- 1981-12-12 JP JP18524581U patent/JPS5889173U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5889173U (ja) | 1983-06-16 |
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