JPS6241981B2 - - Google Patents

Info

Publication number
JPS6241981B2
JPS6241981B2 JP59186073A JP18607384A JPS6241981B2 JP S6241981 B2 JPS6241981 B2 JP S6241981B2 JP 59186073 A JP59186073 A JP 59186073A JP 18607384 A JP18607384 A JP 18607384A JP S6241981 B2 JPS6241981 B2 JP S6241981B2
Authority
JP
Japan
Prior art keywords
fused silica
resin
semi
silica particles
particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP59186073A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6164754A (ja
Inventor
Michio Ito
Yasuaki Shinohara
Yoshiaki Kurata
Kakuichi Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Nippon Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Corp filed Critical Nippon Steel Corp
Priority to JP18607384A priority Critical patent/JPS6164754A/ja
Publication of JPS6164754A publication Critical patent/JPS6164754A/ja
Publication of JPS6241981B2 publication Critical patent/JPS6241981B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
JP18607384A 1984-09-05 1984-09-05 無機充填樹脂組成物の製造方法 Granted JPS6164754A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18607384A JPS6164754A (ja) 1984-09-05 1984-09-05 無機充填樹脂組成物の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18607384A JPS6164754A (ja) 1984-09-05 1984-09-05 無機充填樹脂組成物の製造方法

Publications (2)

Publication Number Publication Date
JPS6164754A JPS6164754A (ja) 1986-04-03
JPS6241981B2 true JPS6241981B2 (enrdf_load_stackoverflow) 1987-09-05

Family

ID=16181909

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18607384A Granted JPS6164754A (ja) 1984-09-05 1984-09-05 無機充填樹脂組成物の製造方法

Country Status (1)

Country Link
JP (1) JPS6164754A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2622110B2 (ja) * 1986-07-07 1997-06-18 日東電工株式会社 半導体装置
JP5038007B2 (ja) * 2007-04-17 2012-10-03 電気化学工業株式会社 組成物、それを用いた金属ベース回路基板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58138740A (ja) * 1982-02-15 1983-08-17 Denki Kagaku Kogyo Kk 樹脂組成物
JPS58219242A (ja) * 1982-06-15 1983-12-20 Toshiba Ceramics Co Ltd Ｉｃプラスチツクパツケ−ジ用フイラ−材

Also Published As

Publication number Publication date
JPS6164754A (ja) 1986-04-03

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