JPS6240856B2 - - Google Patents

Info

Publication number
JPS6240856B2
JPS6240856B2 JP15895582A JP15895582A JPS6240856B2 JP S6240856 B2 JPS6240856 B2 JP S6240856B2 JP 15895582 A JP15895582 A JP 15895582A JP 15895582 A JP15895582 A JP 15895582A JP S6240856 B2 JPS6240856 B2 JP S6240856B2
Authority
JP
Japan
Prior art keywords
substrate
spring
substrate holder
holder
reaction chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP15895582A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5948936A (ja
Inventor
Ryoji Tsunoda
Fumio Muramatsu
Genichi Kanazawa
Makoto Ozawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Electric Corp
Original Assignee
Kokusai Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kokusai Electric Corp filed Critical Kokusai Electric Corp
Priority to JP15895582A priority Critical patent/JPS5948936A/ja
Publication of JPS5948936A publication Critical patent/JPS5948936A/ja
Publication of JPS6240856B2 publication Critical patent/JPS6240856B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manipulator (AREA)
  • Drying Of Semiconductors (AREA)
JP15895582A 1982-09-14 1982-09-14 垂直形半導体基板表面処理装置の基板搬送保持装置 Granted JPS5948936A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15895582A JPS5948936A (ja) 1982-09-14 1982-09-14 垂直形半導体基板表面処理装置の基板搬送保持装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15895582A JPS5948936A (ja) 1982-09-14 1982-09-14 垂直形半導体基板表面処理装置の基板搬送保持装置

Publications (2)

Publication Number Publication Date
JPS5948936A JPS5948936A (ja) 1984-03-21
JPS6240856B2 true JPS6240856B2 (fr) 1987-08-31

Family

ID=15682990

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15895582A Granted JPS5948936A (ja) 1982-09-14 1982-09-14 垂直形半導体基板表面処理装置の基板搬送保持装置

Country Status (1)

Country Link
JP (1) JPS5948936A (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2654982B2 (ja) * 1988-11-08 1997-09-17 山陽特殊製鋼株式会社 Fe−A▲l▼−Si系合金及びその製造方法
CN116100391B (zh) * 2023-02-22 2023-10-10 苏州希瑞格机器人科技有限公司 一种智能夹取定位的法兰表面多角度打磨装置

Also Published As

Publication number Publication date
JPS5948936A (ja) 1984-03-21

Similar Documents

Publication Publication Date Title
US4311427A (en) Wafer transfer system
US4795299A (en) Dial deposition and processing apparatus
US5609459A (en) Door drive mechanisms for substrate carrier and load lock
US5664925A (en) Batchloader for load lock
JP2918780B2 (ja) 加熱された支持部上のシャドーフレーム及び大型平面基板の整列
US4306731A (en) Wafer support assembly
US5613821A (en) Cluster tool batchloader of substrate carrier
JPH0684864A (ja) 処理装置
JP3312163B2 (ja) 真空吸着装置
JP3386986B2 (ja) プラズマ処理装置
JPS6240856B2 (fr)
JPH05175162A (ja) ドライエッチング装置
JP3322630B2 (ja) 回転処理装置
US5439522A (en) Device for locking a flat, preferably discoid substrate onto the substrate plate of a vacuum coating apparatus
JP2002208625A (ja) 半導体ウェハの薄化処理方法
JPH03256677A (ja) 薄片吸着保持装置
JP2000156391A (ja) 半導体ウェーハ検査装置
JP2001127135A (ja) 真空処理装置
JPH01253237A (ja) 真空処理装置
JP2939378B2 (ja) 真空処理装置
JPH04367227A (ja) ウェハの裏面研削処理方法及びこの方法に用いるウェハチャック
JPS60249329A (ja) スパッタエッチング装置
JPH11195690A (ja) ウエーハ移載装置
JP3058006B2 (ja) 成膜装置
JP3067245B2 (ja) 基板処理装置