JPS6240462Y2 - - Google Patents

Info

Publication number
JPS6240462Y2
JPS6240462Y2 JP1982009907U JP990782U JPS6240462Y2 JP S6240462 Y2 JPS6240462 Y2 JP S6240462Y2 JP 1982009907 U JP1982009907 U JP 1982009907U JP 990782 U JP990782 U JP 990782U JP S6240462 Y2 JPS6240462 Y2 JP S6240462Y2
Authority
JP
Japan
Prior art keywords
adhesive
electronic component
conductor layer
printed circuit
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982009907U
Other languages
English (en)
Japanese (ja)
Other versions
JPS58114070U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP990782U priority Critical patent/JPS58114070U/ja
Publication of JPS58114070U publication Critical patent/JPS58114070U/ja
Application granted granted Critical
Publication of JPS6240462Y2 publication Critical patent/JPS6240462Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP990782U 1982-01-29 1982-01-29 プリント基板 Granted JPS58114070U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP990782U JPS58114070U (ja) 1982-01-29 1982-01-29 プリント基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP990782U JPS58114070U (ja) 1982-01-29 1982-01-29 プリント基板

Publications (2)

Publication Number Publication Date
JPS58114070U JPS58114070U (ja) 1983-08-04
JPS6240462Y2 true JPS6240462Y2 (en:Method) 1987-10-16

Family

ID=30022512

Family Applications (1)

Application Number Title Priority Date Filing Date
JP990782U Granted JPS58114070U (ja) 1982-01-29 1982-01-29 プリント基板

Country Status (1)

Country Link
JP (1) JPS58114070U (en:Method)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013004651A (ja) * 2011-06-15 2013-01-07 Panasonic Corp プリント配線板およびそれを備えたモータまたは電気機器

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5525313U (en:Method) * 1978-08-02 1980-02-19
JPS5530838A (en) * 1978-08-24 1980-03-04 Matsushita Electric Industrial Co Ltd Method of mounting chip part
JPS5696670U (en:Method) * 1979-12-21 1981-07-31

Also Published As

Publication number Publication date
JPS58114070U (ja) 1983-08-04

Similar Documents

Publication Publication Date Title
US5001605A (en) Multilayer printed wiring board with single layer vias
US5574629A (en) Solderless printed wiring devices
JPS6240462Y2 (en:Method)
JPH11103145A (ja) 回路基板と表面実装部品
JPH0821764B2 (ja) プリント基板
JP2002026482A (ja) 電子部品の実装構造
JPH0878850A (ja) プリント配線板
JP3735858B2 (ja) プリント基板への部品の半田付け構造
JPS6120791Y2 (en:Method)
JPH0311903Y2 (en:Method)
JPS6236316Y2 (en:Method)
JPH0455360B2 (en:Method)
JP2501678Y2 (ja) 回路基板装置
JP3226147B2 (ja) 表面実装部品の接合構造
JP3696921B2 (ja) 半田処理用治具及び電子部品搭載用基板の製造方法
JP2002374060A (ja) 電子回路板
JPH0535589B2 (en:Method)
JPS6127200Y2 (en:Method)
JP3346215B2 (ja) プリント配線板及びその製造方法
JPH073661Y2 (ja) プリント基板
JPH088510A (ja) リードレスチップキャリア
JPH0536302Y2 (en:Method)
JPS63133695A (ja) プリント配線板
JPH0534137Y2 (en:Method)
JPH0525768U (ja) フラツクスのすいあがり防止構造