JPS623984B2 - - Google Patents

Info

Publication number
JPS623984B2
JPS623984B2 JP56087572A JP8757281A JPS623984B2 JP S623984 B2 JPS623984 B2 JP S623984B2 JP 56087572 A JP56087572 A JP 56087572A JP 8757281 A JP8757281 A JP 8757281A JP S623984 B2 JPS623984 B2 JP S623984B2
Authority
JP
Japan
Prior art keywords
base
thin plate
plate body
hole
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56087572A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57202763A (en
Inventor
Masao Sonoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP56087572A priority Critical patent/JPS57202763A/ja
Publication of JPS57202763A publication Critical patent/JPS57202763A/ja
Publication of JPS623984B2 publication Critical patent/JPS623984B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP56087572A 1981-06-09 1981-06-09 Electronic device Granted JPS57202763A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56087572A JPS57202763A (en) 1981-06-09 1981-06-09 Electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56087572A JPS57202763A (en) 1981-06-09 1981-06-09 Electronic device

Publications (2)

Publication Number Publication Date
JPS57202763A JPS57202763A (en) 1982-12-11
JPS623984B2 true JPS623984B2 (de) 1987-01-28

Family

ID=13918707

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56087572A Granted JPS57202763A (en) 1981-06-09 1981-06-09 Electronic device

Country Status (1)

Country Link
JP (1) JPS57202763A (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63235685A (ja) * 1987-03-23 1988-09-30 Keibunshiya Seisakusho:Kk ベ−ン式真空ポンプ
JPH0291492A (ja) * 1988-09-28 1990-03-30 Aisin Seiki Co Ltd 容積型過給機
JPH0424687U (de) * 1990-06-22 1992-02-27

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016067383A1 (ja) 2014-10-29 2016-05-06 新電元工業株式会社 放熱構造

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63235685A (ja) * 1987-03-23 1988-09-30 Keibunshiya Seisakusho:Kk ベ−ン式真空ポンプ
JPH0291492A (ja) * 1988-09-28 1990-03-30 Aisin Seiki Co Ltd 容積型過給機
JPH0424687U (de) * 1990-06-22 1992-02-27

Also Published As

Publication number Publication date
JPS57202763A (en) 1982-12-11

Similar Documents

Publication Publication Date Title
JP2664754B2 (ja) 高密度電子パッケージ及びその製造方法
KR900003828B1 (ko) 반도체장치 및 그의 제조방법
US5909058A (en) Semiconductor package and semiconductor mounting part
JP3009788B2 (ja) 集積回路用パッケージ
US6404048B2 (en) Heat dissipating microelectronic package
JPH03225854A (ja) 半導体デバイス及びその製造方法
JP3816821B2 (ja) 高周波用パワーモジュール基板及びその製造方法
JPH03108744A (ja) 樹脂封止型半導体装置
JPS6146061B2 (de)
JPS623984B2 (de)
JP2534881B2 (ja) 気密封止回路装置
JPH0382060A (ja) 半導体装置
JPH1051034A (ja) 面実装型電子部品、その製造方法、これを回路基板上に実装する方法、およびこれを実装した回路基板
JP2691352B2 (ja) 電子部品塔載装置
JP2001274278A (ja) マイクロ波半導体装置およびその製造方法
JPH05315467A (ja) 混成集積回路装置
JPS6066842A (ja) 半導体装置
JP3048707B2 (ja) 混成集積回路
JPS61198656A (ja) 半導体装置
JP2002184890A (ja) 表面実装型半導体装置
JP3210503B2 (ja) マルチチップモジュールおよびその製造方法
JP2947468B2 (ja) 複合電子回路装置
JP3011502B2 (ja) 混成集積回路
JP2592869Y2 (ja) 混成ｉｃ装置
JP3440136B2 (ja) 集合電子部品