JPS6238877B2 - - Google Patents
Info
- Publication number
- JPS6238877B2 JPS6238877B2 JP57082231A JP8223182A JPS6238877B2 JP S6238877 B2 JPS6238877 B2 JP S6238877B2 JP 57082231 A JP57082231 A JP 57082231A JP 8223182 A JP8223182 A JP 8223182A JP S6238877 B2 JPS6238877 B2 JP S6238877B2
- Authority
- JP
- Japan
- Prior art keywords
- paste
- flux
- conductive paste
- insulating
- multilayer circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000004907 flux Effects 0.000 claims description 37
- 239000000919 ceramic Substances 0.000 claims description 25
- 239000004020 conductor Substances 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 238000010304 firing Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 description 7
- 238000005245 sintering Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- -1 phthalate ester Chemical class 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8223182A JPS58199595A (ja) | 1982-05-14 | 1982-05-14 | セラミツク多層回路基板の製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8223182A JPS58199595A (ja) | 1982-05-14 | 1982-05-14 | セラミツク多層回路基板の製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58199595A JPS58199595A (ja) | 1983-11-19 |
| JPS6238877B2 true JPS6238877B2 (fr) | 1987-08-20 |
Family
ID=13768627
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8223182A Granted JPS58199595A (ja) | 1982-05-14 | 1982-05-14 | セラミツク多層回路基板の製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58199595A (fr) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4883105A (fr) * | 1972-02-09 | 1973-11-06 | ||
| JPS56160705A (en) * | 1980-05-14 | 1981-12-10 | Matsushita Electric Ind Co Ltd | Metallized composition |
| JPS5782188A (en) * | 1980-11-07 | 1982-05-22 | Hitachi Ltd | Metallizing paste |
-
1982
- 1982-05-14 JP JP8223182A patent/JPS58199595A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4883105A (fr) * | 1972-02-09 | 1973-11-06 | ||
| JPS56160705A (en) * | 1980-05-14 | 1981-12-10 | Matsushita Electric Ind Co Ltd | Metallized composition |
| JPS5782188A (en) * | 1980-11-07 | 1982-05-22 | Hitachi Ltd | Metallizing paste |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58199595A (ja) | 1983-11-19 |
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