JPS6238854B2 - - Google Patents

Info

Publication number
JPS6238854B2
JPS6238854B2 JP6106282A JP6106282A JPS6238854B2 JP S6238854 B2 JPS6238854 B2 JP S6238854B2 JP 6106282 A JP6106282 A JP 6106282A JP 6106282 A JP6106282 A JP 6106282A JP S6238854 B2 JPS6238854 B2 JP S6238854B2
Authority
JP
Japan
Prior art keywords
shaft
wafer
guide hole
pushing
push
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP6106282A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58178533A (ja
Inventor
Katsuyoshi Kudo
Fumio Shibata
Norio Kanai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6106282A priority Critical patent/JPS58178533A/ja
Publication of JPS58178533A publication Critical patent/JPS58178533A/ja
Publication of JPS6238854B2 publication Critical patent/JPS6238854B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Jigs For Machine Tools (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP6106282A 1982-04-14 1982-04-14 ウエ−ハ押上げ装置 Granted JPS58178533A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6106282A JPS58178533A (ja) 1982-04-14 1982-04-14 ウエ−ハ押上げ装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6106282A JPS58178533A (ja) 1982-04-14 1982-04-14 ウエ−ハ押上げ装置

Publications (2)

Publication Number Publication Date
JPS58178533A JPS58178533A (ja) 1983-10-19
JPS6238854B2 true JPS6238854B2 (enrdf_load_stackoverflow) 1987-08-20

Family

ID=13160299

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6106282A Granted JPS58178533A (ja) 1982-04-14 1982-04-14 ウエ−ハ押上げ装置

Country Status (1)

Country Link
JP (1) JPS58178533A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH054282Y2 (enrdf_load_stackoverflow) * 1984-12-04 1993-02-02
JPS63308337A (ja) * 1987-06-10 1988-12-15 Teru Kyushu Kk スピンナ−
JP5306065B2 (ja) * 2009-06-04 2013-10-02 株式会社荏原製作所 ドレッシング装置およびドレッシング方法
CN110246783B (zh) * 2019-06-10 2021-06-15 宁波润华全芯微电子设备有限公司 一种去胶机夹持主轴

Also Published As

Publication number Publication date
JPS58178533A (ja) 1983-10-19

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