JPS6236859Y2 - - Google Patents
Info
- Publication number
- JPS6236859Y2 JPS6236859Y2 JP7241984U JP7241984U JPS6236859Y2 JP S6236859 Y2 JPS6236859 Y2 JP S6236859Y2 JP 7241984 U JP7241984 U JP 7241984U JP 7241984 U JP7241984 U JP 7241984U JP S6236859 Y2 JPS6236859 Y2 JP S6236859Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- contact member
- cathode
- plated
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 37
- 238000009713 electroplating Methods 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 3
- 238000007747 plating Methods 0.000 description 12
- 239000000463 material Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7241984U JPS60185664U (ja) | 1984-05-17 | 1984-05-17 | 電気メツキ装置における陰極用リ−ド線 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7241984U JPS60185664U (ja) | 1984-05-17 | 1984-05-17 | 電気メツキ装置における陰極用リ−ド線 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60185664U JPS60185664U (ja) | 1985-12-09 |
| JPS6236859Y2 true JPS6236859Y2 (enrdf_load_stackoverflow) | 1987-09-19 |
Family
ID=30610800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7241984U Granted JPS60185664U (ja) | 1984-05-17 | 1984-05-17 | 電気メツキ装置における陰極用リ−ド線 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60185664U (enrdf_load_stackoverflow) |
-
1984
- 1984-05-17 JP JP7241984U patent/JPS60185664U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60185664U (ja) | 1985-12-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3081558B2 (ja) | 内面めっき方法及び内面めっき用補助極 | |
| US5227041A (en) | Dry contact electroplating apparatus | |
| JP2001212495A (ja) | 部品の製造方法、部品の製造装置、部品の吊り下げ体形成方法、及び、部品の吊り下げ体形成装置 | |
| JPS6236859Y2 (enrdf_load_stackoverflow) | ||
| JPH09167610A (ja) | 鉛蓄電池用端子 | |
| JPH0411633B2 (enrdf_load_stackoverflow) | ||
| CN207005043U (zh) | 一种新型汽车用接地螺母 | |
| JP2001007268A (ja) | 半導体装置及びその製造方法 | |
| JPH0280599A (ja) | Ｉｃリードフレームのメッキ用引っ掛け治具 | |
| CN219598762U (zh) | 一种具有水平检测功能的夹具 | |
| KR20190138489A (ko) | 금형 도금장치 | |
| JP2943334B2 (ja) | メッキ方法及び同方法に用いるメッキ用ラック | |
| CN221522843U (zh) | 一种环状外圆无痕挂镀装置 | |
| JPH01319695A (ja) | 電解用陰極板 | |
| JP2001085018A (ja) | アルカリ乾電池の負極集電体 | |
| JPH01276613A (ja) | 固体電解コンデンサの製造方法 | |
| JPH05166688A (ja) | 電解コンデンサ用リードの製造方法 | |
| CA1231830A (en) | Making a wave guide | |
| JPH0538058Y2 (enrdf_load_stackoverflow) | ||
| JPS6358397B2 (enrdf_load_stackoverflow) | ||
| JPH0554555U (ja) | メッキ作業用治具 | |
| JPS6050348B2 (ja) | 半導体装置の外装メツキ方法 | |
| JPS60177587A (ja) | 自動被覆電線取付装置 | |
| JPS6331145A (ja) | Ｉｃのリ−ド成形方法と装置 | |
| JPS633445A (ja) | Ｉｃのリ−ド成形方法及びその装置 |