JPS6236800B2 - - Google Patents
Info
- Publication number
- JPS6236800B2 JPS6236800B2 JP2994480A JP2994480A JPS6236800B2 JP S6236800 B2 JPS6236800 B2 JP S6236800B2 JP 2994480 A JP2994480 A JP 2994480A JP 2994480 A JP2994480 A JP 2994480A JP S6236800 B2 JPS6236800 B2 JP S6236800B2
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- filler metal
- brazing filler
- alloy
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Conductive Materials (AREA)
- Ceramic Products (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2994480A JPS56127742A (en) | 1980-03-10 | 1980-03-10 | Cu-mn alloy solder material free from generation of pinhole deficiency |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2994480A JPS56127742A (en) | 1980-03-10 | 1980-03-10 | Cu-mn alloy solder material free from generation of pinhole deficiency |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56127742A JPS56127742A (en) | 1981-10-06 |
JPS6236800B2 true JPS6236800B2 (en, 2012) | 1987-08-08 |
Family
ID=12290092
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2994480A Granted JPS56127742A (en) | 1980-03-10 | 1980-03-10 | Cu-mn alloy solder material free from generation of pinhole deficiency |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56127742A (en, 2012) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6064158A (ja) * | 1983-09-19 | 1985-04-12 | Sanyo Electric Co Ltd | 太陽熱集熱器の製造方法 |
JPH08206876A (ja) * | 1995-02-02 | 1996-08-13 | Mazda Motor Corp | ろう付方法およびそのろう材 |
DE102009032371A1 (de) * | 2009-07-08 | 2011-01-13 | Berkenhoff Gmbh | Zusatzwerkstoff zum Löten von Stahlblechen |
CN108340092B (zh) * | 2018-03-02 | 2020-01-10 | 华北水利水电大学 | 一种用于阳极钢爪修复的钎焊材料及其制备方法 |
-
1980
- 1980-03-10 JP JP2994480A patent/JPS56127742A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS56127742A (en) | 1981-10-06 |
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