JPS6236534U - - Google Patents

Info

Publication number
JPS6236534U
JPS6236534U JP1985127972U JP12797285U JPS6236534U JP S6236534 U JPS6236534 U JP S6236534U JP 1985127972 U JP1985127972 U JP 1985127972U JP 12797285 U JP12797285 U JP 12797285U JP S6236534 U JPS6236534 U JP S6236534U
Authority
JP
Japan
Prior art keywords
die
lead frame
semiconductor manufacturing
hole
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985127972U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985127972U priority Critical patent/JPS6236534U/ja
Publication of JPS6236534U publication Critical patent/JPS6236534U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/073

Landscapes

  • Die Bonding (AREA)
JP1985127972U 1985-08-20 1985-08-20 Pending JPS6236534U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985127972U JPS6236534U (enExample) 1985-08-20 1985-08-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985127972U JPS6236534U (enExample) 1985-08-20 1985-08-20

Publications (1)

Publication Number Publication Date
JPS6236534U true JPS6236534U (enExample) 1987-03-04

Family

ID=31023219

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985127972U Pending JPS6236534U (enExample) 1985-08-20 1985-08-20

Country Status (1)

Country Link
JP (1) JPS6236534U (enExample)

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