JPS6169826U - - Google Patents
Info
- Publication number
- JPS6169826U JPS6169826U JP1984153138U JP15313884U JPS6169826U JP S6169826 U JPS6169826 U JP S6169826U JP 1984153138 U JP1984153138 U JP 1984153138U JP 15313884 U JP15313884 U JP 15313884U JP S6169826 U JPS6169826 U JP S6169826U
- Authority
- JP
- Japan
- Prior art keywords
- plating layer
- semiconductor element
- package
- base material
- die bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/30—
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- H10W72/073—
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- H10W72/931—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984153138U JPS6169826U (enExample) | 1984-10-12 | 1984-10-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984153138U JPS6169826U (enExample) | 1984-10-12 | 1984-10-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6169826U true JPS6169826U (enExample) | 1986-05-13 |
Family
ID=30711173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984153138U Pending JPS6169826U (enExample) | 1984-10-12 | 1984-10-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6169826U (enExample) |
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1984
- 1984-10-12 JP JP1984153138U patent/JPS6169826U/ja active Pending