JPS6236385B2 - - Google Patents

Info

Publication number
JPS6236385B2
JPS6236385B2 JP56133959A JP13395981A JPS6236385B2 JP S6236385 B2 JPS6236385 B2 JP S6236385B2 JP 56133959 A JP56133959 A JP 56133959A JP 13395981 A JP13395981 A JP 13395981A JP S6236385 B2 JPS6236385 B2 JP S6236385B2
Authority
JP
Japan
Prior art keywords
integrated circuit
semiconductor integrated
frame
circuit chip
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56133959A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5835952A (ja
Inventor
Mitsuru Nitsuta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP56133959A priority Critical patent/JPS5835952A/ja
Publication of JPS5835952A publication Critical patent/JPS5835952A/ja
Publication of JPS6236385B2 publication Critical patent/JPS6236385B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP56133959A 1981-08-28 1981-08-28 半導体集積回路装置 Granted JPS5835952A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56133959A JPS5835952A (ja) 1981-08-28 1981-08-28 半導体集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56133959A JPS5835952A (ja) 1981-08-28 1981-08-28 半導体集積回路装置

Publications (2)

Publication Number Publication Date
JPS5835952A JPS5835952A (ja) 1983-03-02
JPS6236385B2 true JPS6236385B2 (de) 1987-08-06

Family

ID=15117075

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56133959A Granted JPS5835952A (ja) 1981-08-28 1981-08-28 半導体集積回路装置

Country Status (1)

Country Link
JP (1) JPS5835952A (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6437042A (en) * 1987-07-31 1989-02-07 Ibiden Co Ltd Substrate for carrying electronic component
EP2779377B1 (de) * 2011-11-09 2018-04-18 Mitsubishi Electric Corporation Elektrische drehmaschine

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4728441U (de) * 1971-04-14 1972-12-01
JPS4957363A (de) * 1972-10-04 1974-06-04
JPS5117667A (en) * 1974-08-05 1976-02-12 Matsushita Electric Ind Co Ltd Handotaisochino seizohoho
JPS5341177A (en) * 1976-09-28 1978-04-14 Nec Corp Mounting method of electronic parts
JPS54148377A (en) * 1978-05-15 1979-11-20 Ngk Spark Plug Co Leadless package for attaching semiconductor chip
JPS5669897A (en) * 1979-11-09 1981-06-11 Nippon Electric Co High density package structure

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4728441U (de) * 1971-04-14 1972-12-01
JPS4957363A (de) * 1972-10-04 1974-06-04
JPS5117667A (en) * 1974-08-05 1976-02-12 Matsushita Electric Ind Co Ltd Handotaisochino seizohoho
JPS5341177A (en) * 1976-09-28 1978-04-14 Nec Corp Mounting method of electronic parts
JPS54148377A (en) * 1978-05-15 1979-11-20 Ngk Spark Plug Co Leadless package for attaching semiconductor chip
JPS5669897A (en) * 1979-11-09 1981-06-11 Nippon Electric Co High density package structure

Also Published As

Publication number Publication date
JPS5835952A (ja) 1983-03-02

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