JPS6236279Y2 - - Google Patents
Info
- Publication number
- JPS6236279Y2 JPS6236279Y2 JP16915782U JP16915782U JPS6236279Y2 JP S6236279 Y2 JPS6236279 Y2 JP S6236279Y2 JP 16915782 U JP16915782 U JP 16915782U JP 16915782 U JP16915782 U JP 16915782U JP S6236279 Y2 JPS6236279 Y2 JP S6236279Y2
- Authority
- JP
- Japan
- Prior art keywords
- frame side
- bodies
- rear frame
- motherboard
- furnace
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000009792 diffusion process Methods 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 12
- 229920001296 polysiloxane Polymers 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 235000012431 wafers Nutrition 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 238000003466 welding Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16915782U JPS5972726U (ja) | 1982-11-08 | 1982-11-08 | 拡散治具のマザ−ボ−ト |
| EP83107498A EP0100539A3 (en) | 1982-07-30 | 1983-07-29 | Assembled device for supporting semiconductor wafers or the like |
| KR1019830003575A KR920001025B1 (ko) | 1982-07-30 | 1983-07-30 | 반도체 웨이퍼 지지용 조립장치 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16915782U JPS5972726U (ja) | 1982-11-08 | 1982-11-08 | 拡散治具のマザ−ボ−ト |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5972726U JPS5972726U (ja) | 1984-05-17 |
| JPS6236279Y2 true JPS6236279Y2 (cs) | 1987-09-16 |
Family
ID=30369619
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16915782U Granted JPS5972726U (ja) | 1982-07-30 | 1982-11-08 | 拡散治具のマザ−ボ−ト |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5972726U (cs) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2802234B2 (ja) * | 1994-08-31 | 1998-09-24 | 信越石英株式会社 | シリコンウエハ熱処理用組合せ治具とその製造方法 |
-
1982
- 1982-11-08 JP JP16915782U patent/JPS5972726U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5972726U (ja) | 1984-05-17 |
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