JPS6236112Y2 - - Google Patents
Info
- Publication number
- JPS6236112Y2 JPS6236112Y2 JP10840381U JP10840381U JPS6236112Y2 JP S6236112 Y2 JPS6236112 Y2 JP S6236112Y2 JP 10840381 U JP10840381 U JP 10840381U JP 10840381 U JP10840381 U JP 10840381U JP S6236112 Y2 JPS6236112 Y2 JP S6236112Y2
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- sensitive chip
- lead piece
- adhesive layer
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000012790 adhesive layer Substances 0.000 claims description 7
- 239000012530 fluid Substances 0.000 claims description 6
- 125000006850 spacer group Chemical group 0.000 description 7
- 238000000034 method Methods 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000036772 blood pressure Effects 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10840381U JPS5814137U (ja) | 1981-07-20 | 1981-07-20 | 半導体感圧装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10840381U JPS5814137U (ja) | 1981-07-20 | 1981-07-20 | 半導体感圧装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5814137U JPS5814137U (ja) | 1983-01-28 |
| JPS6236112Y2 true JPS6236112Y2 (US08063081-20111122-C00044.png) | 1987-09-14 |
Family
ID=29902810
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10840381U Granted JPS5814137U (ja) | 1981-07-20 | 1981-07-20 | 半導体感圧装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5814137U (US08063081-20111122-C00044.png) |
-
1981
- 1981-07-20 JP JP10840381U patent/JPS5814137U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5814137U (ja) | 1983-01-28 |
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