JPS6234773U - - Google Patents
Info
- Publication number
- JPS6234773U JPS6234773U JP12733685U JP12733685U JPS6234773U JP S6234773 U JPS6234773 U JP S6234773U JP 12733685 U JP12733685 U JP 12733685U JP 12733685 U JP12733685 U JP 12733685U JP S6234773 U JPS6234773 U JP S6234773U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- connection structure
- magnetic
- electrode connection
- anisotropic conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Description
第１図および第２図はこの考案の一実施例を示
したもので、第１図は集積回路チツプと配線基板
との電極を接続した状態の断面図、第２図は電極
接続方法を工程順に示す断面図である。第３図お
よび第４図は従来の電極接続構造を示したもので
、第３図は集積回路チツプと配線基板との電極を
接続した状態の断面図、第４図は電極接続方法を
示す断面図である。
１１……集積回路チツプ、１２……電極、１３
……配線基板、１４……磁性電極、１４ａ……導
電層、１４ｂ……磁性体層、１５……異方導電性
接着剤、１６……絶縁性接着剤、１７……導電性
粒子。
Figures 1 and 2 show an embodiment of this invention. Figure 1 is a cross-sectional view of the integrated circuit chip and wiring board with electrodes connected to each other, and Figure 2 shows the process of electrode connection. It is sectional drawing shown in order. Figures 3 and 4 show conventional electrode connection structures. Figure 3 is a cross-sectional view of the integrated circuit chip and wiring board with electrodes connected, and Figure 4 is a cross-sectional view showing the electrode connection method. It is a diagram. 11... integrated circuit chip, 12... electrode, 13
... Wiring board, 14 ... Magnetic electrode, 14a ... Conductive layer, 14b ... Magnetic layer, 15 ... Anisotropic conductive adhesive, 16 ... Insulating adhesive, 17 ... Conductive particles.
Claims (1)
前記第１の部材の電極と対応させて形成された電
極とを異方導電性接着剤によつて接続する電極接
続構造において、少なくとも一方の部材の電極を
磁性電極とするとともに、前記両部材の電極を、
絶縁性接着剤中に磁性を有する導電性粒子を混入
させた異方導電性接着剤によつて接続したことを
特徴とする電極接続構造。 In an electrode connection structure in which an electrode formed on a first member and an electrode formed on a second member corresponding to the electrode of the first member are connected by an anisotropic conductive adhesive, at least The electrode of one member is a magnetic electrode, and the electrodes of both members are
An electrode connection structure characterized in that the electrode connection structure is connected by an anisotropic conductive adhesive in which magnetic conductive particles are mixed into an insulating adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12733685U JPH0334064Y2 (en) | 1985-08-21 | 1985-08-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12733685U JPH0334064Y2 (en) | 1985-08-21 | 1985-08-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6234773U true JPS6234773U (en) | 1987-02-28 |
| JPH0334064Y2 JPH0334064Y2 (en) | 1991-07-18 |
Family
ID=31021988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12733685U Expired JPH0334064Y2 (en) | 1985-08-21 | 1985-08-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0334064Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01100822A (en) * | 1987-09-18 | 1989-04-19 | American Teleph & Telegr Co <Att> | Manufacture method and apparatus for anisotropic conducting material |
| US11901325B2 (en) | 2015-01-13 | 2024-02-13 | Dexerials Corporation | Multilayer substrate |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI786440B (en) * | 2015-01-13 | 2022-12-11 | 日商迪睿合股份有限公司 | Multilayer substrate, and method for manufacturing multilayer substrate |
-
1985
- 1985-08-21 JP JP12733685U patent/JPH0334064Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01100822A (en) * | 1987-09-18 | 1989-04-19 | American Teleph & Telegr Co <Att> | Manufacture method and apparatus for anisotropic conducting material |
| US11901325B2 (en) | 2015-01-13 | 2024-02-13 | Dexerials Corporation | Multilayer substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0334064Y2 (en) | 1991-07-18 |
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