JPH0289868U - - Google Patents
Info
- Publication number
- JPH0289868U JPH0289868U JP17085588U JP17085588U JPH0289868U JP H0289868 U JPH0289868 U JP H0289868U JP 17085588 U JP17085588 U JP 17085588U JP 17085588 U JP17085588 U JP 17085588U JP H0289868 U JPH0289868 U JP H0289868U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- spacer
- pattern
- engaging part
- engaged
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 125000006850 spacer group Chemical group 0.000 claims description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 7
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は本考案のプリント基板装置の要部断面
図、第２図はプリント基板の平面図、第３図はプ
リント基板上の配線回路パターン図、第４図は従
来例に於ける第１図相当図である。
２……基板Ａ、３……基板Ｂ、５……導電パタ
ーン、６……配線回路パターン、７……アースパ
ターン、１３……係着部Ａ、１４……係着部Ｂ、
１５……リード線、１６……スペーサ。
Figure 1 is a cross-sectional view of the main parts of the printed circuit board device of the present invention, Figure 2 is a plan view of the printed circuit board, Figure 3 is a diagram of the wiring circuit pattern on the printed circuit board, and Figure 4 is the first diagram of the conventional example. It is a figure equivalent figure. 2... Board A, 3... Board B, 5... Conductive pattern, 6... Wiring circuit pattern, 7... Earth pattern, 13... Engaging part A, 14... Engaging part B,
15... Lead wire, 16... Spacer.
Claims (1)
板Ａにアースパターンを含む配線回路パターンを
設け、前記基板Ｂに導電パターンを設け、前記ア
ースパターンと導電パターンとをリード線にて接
続し、分割された前記基板Ｂを、前記基板Ａの上
方に間隔を開けて配するためのスペーサを設け、
前記基板Ａに、前記スペーサの一端が係着する係
着部Ａを設けると共に、前記基板Ｂに、前記スペ
ーサの他端が係着する係着部Ｂを設けたことを特
徴とするプリント基板装置。 A substrate A and a substrate B are formed to be separable, a wiring circuit pattern including a ground pattern is provided on the substrate A, a conductive pattern is provided on the substrate B, and the ground pattern and the conductive pattern are connected with a lead wire. , providing a spacer for arranging the divided substrate B above the substrate A with a space therebetween;
A printed circuit board device characterized in that the substrate A is provided with an engaging part A to which one end of the spacer is engaged, and the board B is provided with an engaging part B to which the other end of the spacer is engaged. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17085588U JPH0289868U (en) | 1988-12-27 | 1988-12-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17085588U JPH0289868U (en) | 1988-12-27 | 1988-12-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0289868U true JPH0289868U (en) | 1990-07-17 |
Family
ID=31462163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17085588U Pending JPH0289868U (en) | 1988-12-27 | 1988-12-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0289868U (en) |
-
1988
- 1988-12-27 JP JP17085588U patent/JPH0289868U/ja active Pending