JPS6234439U - - Google Patents
Info
- Publication number
- JPS6234439U JPS6234439U JP1985127046U JP12704685U JPS6234439U JP S6234439 U JPS6234439 U JP S6234439U JP 1985127046 U JP1985127046 U JP 1985127046U JP 12704685 U JP12704685 U JP 12704685U JP S6234439 U JPS6234439 U JP S6234439U
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- semiconductor device
- heat sink
- fixing
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 4
- 239000008188 pellet Substances 0.000 claims description 3
- 239000012212 insulator Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000000463 material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985127046U JPS6234439U (un) | 1985-08-19 | 1985-08-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985127046U JPS6234439U (un) | 1985-08-19 | 1985-08-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6234439U true JPS6234439U (un) | 1987-02-28 |
Family
ID=31021423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985127046U Pending JPS6234439U (un) | 1985-08-19 | 1985-08-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6234439U (un) |
-
1985
- 1985-08-19 JP JP1985127046U patent/JPS6234439U/ja active Pending
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