JPS6234141B2 - - Google Patents

Info

Publication number
JPS6234141B2
JPS6234141B2 JP56127048A JP12704881A JPS6234141B2 JP S6234141 B2 JPS6234141 B2 JP S6234141B2 JP 56127048 A JP56127048 A JP 56127048A JP 12704881 A JP12704881 A JP 12704881A JP S6234141 B2 JPS6234141 B2 JP S6234141B2
Authority
JP
Japan
Prior art keywords
insulating film
hole
tape carrier
wiring pattern
metal wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56127048A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5828862A (ja
Inventor
Takashi Myamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP56127048A priority Critical patent/JPS5828862A/ja
Publication of JPS5828862A publication Critical patent/JPS5828862A/ja
Publication of JPS6234141B2 publication Critical patent/JPS6234141B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15173—Fan-out arrangement of the internal vias in a single layer of the multilayer substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
JP56127048A 1981-08-13 1981-08-13 テ−プキヤリア Granted JPS5828862A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56127048A JPS5828862A (ja) 1981-08-13 1981-08-13 テ−プキヤリア

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56127048A JPS5828862A (ja) 1981-08-13 1981-08-13 テ−プキヤリア

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP63099776A Division JPS63288038A (ja) 1988-04-22 1988-04-22 テープキャリア

Publications (2)

Publication Number Publication Date
JPS5828862A JPS5828862A (ja) 1983-02-19
JPS6234141B2 true JPS6234141B2 (enrdf_load_stackoverflow) 1987-07-24

Family

ID=14950312

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56127048A Granted JPS5828862A (ja) 1981-08-13 1981-08-13 テ−プキヤリア

Country Status (1)

Country Link
JP (1) JPS5828862A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59161848A (ja) * 1983-03-04 1984-09-12 Nec Corp 樹脂封止型半導体装置の製造装置
JPH056659Y2 (enrdf_load_stackoverflow) * 1987-11-17 1993-02-19
US4980219A (en) * 1988-04-06 1990-12-25 Casio Computer Co., Ltd. Carrier tape for bonding IC devices and method of using the same

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5327364A (en) * 1976-08-26 1978-03-14 Fujitsu Ltd Film carrier integrated circuit and its production
JPS5410867A (en) * 1977-06-25 1979-01-26 Toyota Motor Corp Brake booster for vehicle
JPS54155869A (en) * 1978-05-29 1979-12-08 Seiko Epson Corp Crystal watch

Also Published As

Publication number Publication date
JPS5828862A (ja) 1983-02-19

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