JPS6232631A - 集積回路パッケージ用リード片の製法 - Google Patents

集積回路パッケージ用リード片の製法

Info

Publication number
JPS6232631A
JPS6232631A JP60171068A JP17106885A JPS6232631A JP S6232631 A JPS6232631 A JP S6232631A JP 60171068 A JP60171068 A JP 60171068A JP 17106885 A JP17106885 A JP 17106885A JP S6232631 A JPS6232631 A JP S6232631A
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit package
glass
thermal expansion
silicon carbide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60171068A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0431187B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Masatoshi Tsuchiya
土屋　正利
Satoru Ogiwara
荻原　覚
Hiromi Kozobara
楮原　広美
Kanji Otsuka
寛治 大塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP60171068A priority Critical patent/JPS6232631A/ja
Priority to US06/890,533 priority patent/US4729010A/en
Priority to EP86305894A priority patent/EP0211618B1/en
Priority to DE8686305894T priority patent/DE3672709D1/de
Publication of JPS6232631A publication Critical patent/JPS6232631A/ja
Publication of JPH0431187B2 publication Critical patent/JPH0431187B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Heat Treatment Of Steel (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP60171068A 1985-08-05 1985-08-05 集積回路パッケージ用リード片の製法 Granted JPS6232631A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP60171068A JPS6232631A (ja) 1985-08-05 1985-08-05 集積回路パッケージ用リード片の製法
US06/890,533 US4729010A (en) 1985-08-05 1986-07-30 Integrated circuit package with low-thermal expansion lead pieces
EP86305894A EP0211618B1 (en) 1985-08-05 1986-07-31 Integrated circuit package
DE8686305894T DE3672709D1 (de) 1985-08-05 1986-07-31 Integrierte schaltungspackung.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60171068A JPS6232631A (ja) 1985-08-05 1985-08-05 集積回路パッケージ用リード片の製法

Publications (2)

Publication Number Publication Date
JPS6232631A true JPS6232631A (ja) 1987-02-12
JPH0431187B2 JPH0431187B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-05-25

Family

ID=15916442

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60171068A Granted JPS6232631A (ja) 1985-08-05 1985-08-05 集積回路パッケージ用リード片の製法

Country Status (1)

Country Link
JP (1) JPS6232631A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03167853A (ja) * 1989-11-27 1991-07-19 Kyocera Corp 半導体素子収納用パッケージ
JPH03173154A (ja) * 1989-11-30 1991-07-26 Kyocera Corp 半導体素子収納用パッケージ
JPH0456343A (ja) * 1990-06-26 1992-02-24 Kyocera Corp 半導体素子収納用パッケージ

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54124972A (en) * 1978-03-23 1979-09-28 Tamagawa Kikai Kinzoku Kk Semiconductor lead material
JPS5596664A (en) * 1979-01-16 1980-07-23 Furukawa Electric Co Ltd:The Copper alloy for lead frame of semiconductor element
JPS563653A (en) * 1979-06-23 1981-01-14 Nippon Gakki Seizo Kk Manufacture of seal bonding material
JPS5933857A (ja) * 1982-08-19 1984-02-23 Hitachi Metals Ltd Ｉｃリ−ドフレ−ム材料とその製造方法
JPS5996245A (ja) * 1982-11-22 1984-06-02 Daido Steel Co Ltd リ−ドフレ−ム材料およびその製造方法
JPS59198741A (ja) * 1983-04-25 1984-11-10 Nippon Gakki Seizo Kk 半導体集積回路用リ−ドフレ−ム材
JPS61235535A (ja) * 1985-04-10 1986-10-20 Hitachi Metals Ltd リ−ドフレ−ム用合金

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54124972A (en) * 1978-03-23 1979-09-28 Tamagawa Kikai Kinzoku Kk Semiconductor lead material
JPS5596664A (en) * 1979-01-16 1980-07-23 Furukawa Electric Co Ltd:The Copper alloy for lead frame of semiconductor element
JPS563653A (en) * 1979-06-23 1981-01-14 Nippon Gakki Seizo Kk Manufacture of seal bonding material
JPS5933857A (ja) * 1982-08-19 1984-02-23 Hitachi Metals Ltd Ｉｃリ−ドフレ−ム材料とその製造方法
JPS5996245A (ja) * 1982-11-22 1984-06-02 Daido Steel Co Ltd リ−ドフレ−ム材料およびその製造方法
JPS59198741A (ja) * 1983-04-25 1984-11-10 Nippon Gakki Seizo Kk 半導体集積回路用リ−ドフレ−ム材
JPS61235535A (ja) * 1985-04-10 1986-10-20 Hitachi Metals Ltd リ−ドフレ−ム用合金

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03167853A (ja) * 1989-11-27 1991-07-19 Kyocera Corp 半導体素子収納用パッケージ
JPH03173154A (ja) * 1989-11-30 1991-07-26 Kyocera Corp 半導体素子収納用パッケージ
JPH0456343A (ja) * 1990-06-26 1992-02-24 Kyocera Corp 半導体素子収納用パッケージ

Also Published As

Publication number Publication date
JPH0431187B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-05-25

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