JPS6232113A - ポリエポキシ樹脂の硬化方法 - Google Patents
ポリエポキシ樹脂の硬化方法Info
- Publication number
- JPS6232113A JPS6232113A JP17269985A JP17269985A JPS6232113A JP S6232113 A JPS6232113 A JP S6232113A JP 17269985 A JP17269985 A JP 17269985A JP 17269985 A JP17269985 A JP 17269985A JP S6232113 A JPS6232113 A JP S6232113A
- Authority
- JP
- Japan
- Prior art keywords
- polyepoxy resin
- resin
- curing
- polyepoxy
- cured
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 23
- 239000011347 resin Substances 0.000 title claims abstract description 23
- NKVXEXBFJUACKT-UHFFFAOYSA-N 4-benzyl-5-methyl-2-phenyl-1h-imidazole Chemical compound CC=1NC(C=2C=CC=CC=2)=NC=1CC1=CC=CC=C1 NKVXEXBFJUACKT-UHFFFAOYSA-N 0.000 claims abstract 2
- 238000000034 method Methods 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims 1
- 238000013508 migration Methods 0.000 abstract description 10
- 230000005012 migration Effects 0.000 abstract description 9
- 239000000203 mixture Substances 0.000 abstract description 7
- 239000003795 chemical substances by application Substances 0.000 abstract description 4
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 125000003700 epoxy group Chemical group 0.000 abstract description 3
- 238000009413 insulation Methods 0.000 abstract description 2
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 abstract 1
- 238000012360 testing method Methods 0.000 description 6
- 238000009472 formulation Methods 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000009835 boiling Methods 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910002012 Aerosil® Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000004034 viscosity adjusting agent Substances 0.000 description 2
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 150000001241 acetals Chemical class 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- KCXMKQUNVWSEMD-UHFFFAOYSA-N benzyl chloride Chemical compound ClCC1=CC=CC=C1 KCXMKQUNVWSEMD-UHFFFAOYSA-N 0.000 description 1
- 229940073608 benzyl chloride Drugs 0.000 description 1
- XUCHXOAWJMEFLF-UHFFFAOYSA-N bisphenol F diglycidyl ether Chemical compound C1OC1COC(C=C1)=CC=C1CC(C=C1)=CC=C1OCC1CO1 XUCHXOAWJMEFLF-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17269985A JPS6232113A (ja) | 1985-08-05 | 1985-08-05 | ポリエポキシ樹脂の硬化方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17269985A JPS6232113A (ja) | 1985-08-05 | 1985-08-05 | ポリエポキシ樹脂の硬化方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6232113A true JPS6232113A (ja) | 1987-02-12 |
| JPH0250129B2 JPH0250129B2 (enrdf_load_stackoverflow) | 1990-11-01 |
Family
ID=15946707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17269985A Granted JPS6232113A (ja) | 1985-08-05 | 1985-08-05 | ポリエポキシ樹脂の硬化方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6232113A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0627499A1 (en) * | 1993-05-10 | 1994-12-07 | Shikoku Chemicals Corporation | Agent for treating surfaces of copper and copper alloys |
| US5773090A (en) * | 1994-05-27 | 1998-06-30 | Herberts Gellschaft Mit Beschrankter Haftung | Process for coating phosphated metal substrates |
| KR101098506B1 (ko) | 2003-03-19 | 2011-12-26 | 시코쿠가세이고교가부시키가이샤 | 신규 이미다졸 화합물 및 그의 용도 |
-
1985
- 1985-08-05 JP JP17269985A patent/JPS6232113A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0627499A1 (en) * | 1993-05-10 | 1994-12-07 | Shikoku Chemicals Corporation | Agent for treating surfaces of copper and copper alloys |
| US5773090A (en) * | 1994-05-27 | 1998-06-30 | Herberts Gellschaft Mit Beschrankter Haftung | Process for coating phosphated metal substrates |
| KR101098506B1 (ko) | 2003-03-19 | 2011-12-26 | 시코쿠가세이고교가부시키가이샤 | 신규 이미다졸 화합물 및 그의 용도 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0250129B2 (enrdf_load_stackoverflow) | 1990-11-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2016018191A1 (en) | Epoxy resin-based electroconductive composition | |
| JPH05331355A (ja) | 導電性ペースト | |
| JPS6232113A (ja) | ポリエポキシ樹脂の硬化方法 | |
| JPS61233013A (ja) | ポリエポキシ樹脂の硬化方法 | |
| JPH038374B2 (enrdf_load_stackoverflow) | ||
| EP0166588A1 (en) | Epoxy resin composition | |
| JPS61286369A (ja) | ２―フェニル―４，５―ジベンジルイミダゾール及び該化合物の合成方法 | |
| JPS6330578A (ja) | エポキシ樹脂系レジストインク組成物 | |
| JPH0125790B2 (enrdf_load_stackoverflow) | ||
| JPS61221279A (ja) | 金属及びフレキシブルフイルム用一液型絶縁性接着剤 | |
| JPS61210076A (ja) | 新規な２−置換−４，６−ジアミノ−ｓ−トリアジン・イソシアヌル酸付加物、該付加物の合成方法及び該付加物を用いるポリエポキシ樹脂の硬化方法 | |
| JPS6330520A (ja) | 積層板用エポキシ樹脂組成物 | |
| JPH02281068A (ja) | 層間絶縁に好適な樹脂組成物 | |
| JPH0575580B2 (enrdf_load_stackoverflow) | ||
| JP3243027B2 (ja) | 銅張積層板 | |
| JPH0321587B2 (enrdf_load_stackoverflow) | ||
| JP2001115126A (ja) | 可撓性プリント配線回路用エポキシ樹脂接着剤 | |
| JPH0119834B2 (enrdf_load_stackoverflow) | ||
| JPS6112772A (ja) | エポキシ樹脂インキ組成物 | |
| JPH01118563A (ja) | 絶縁性ペースト | |
| JPS62223276A (ja) | プリント回路用絶縁膜材料 | |
| JP2900048B2 (ja) | 接着剤層を有するガラスクロス・エポキシシート | |
| JP3534848B2 (ja) | 絶縁性ペースト | |
| JPS63105080A (ja) | エポキシ樹脂インキ組成物及びその製法 | |
| JPH0570757A (ja) | 接着剤組成物 |