JPS6230718B2 - - Google Patents
Info
- Publication number
- JPS6230718B2 JPS6230718B2 JP56147623A JP14762381A JPS6230718B2 JP S6230718 B2 JPS6230718 B2 JP S6230718B2 JP 56147623 A JP56147623 A JP 56147623A JP 14762381 A JP14762381 A JP 14762381A JP S6230718 B2 JPS6230718 B2 JP S6230718B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- flexible
- electronic circuit
- small electronic
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 16
- 229910000679 solder Inorganic materials 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 239000011888 foil Substances 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 230000010354 integration Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14762381A JPS5848496A (ja) | 1981-09-17 | 1981-09-17 | 小型電子回路部品構体 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14762381A JPS5848496A (ja) | 1981-09-17 | 1981-09-17 | 小型電子回路部品構体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5848496A JPS5848496A (ja) | 1983-03-22 |
JPS6230718B2 true JPS6230718B2 (no) | 1987-07-03 |
Family
ID=15434507
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14762381A Granted JPS5848496A (ja) | 1981-09-17 | 1981-09-17 | 小型電子回路部品構体 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5848496A (no) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63147115U (no) * | 1987-03-16 | 1988-09-28 | ||
JPH03503012A (ja) * | 1988-07-22 | 1991-07-11 | フォトフィニッシュ コスメチックス インコーポレーテッド | 成形ブラシおよびその製造法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4822747B1 (no) * | 1970-12-10 | 1973-07-09 | ||
JPS5225264A (en) * | 1975-08-21 | 1977-02-25 | Matsushita Electric Ind Co Ltd | Hybrid miniature parts |
JPS5426671B2 (no) * | 1976-02-26 | 1979-09-05 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5124520Y2 (no) * | 1971-07-23 | 1976-06-23 | ||
JPS5426671U (no) * | 1977-07-26 | 1979-02-21 | ||
JPS5833708Y2 (ja) * | 1978-10-02 | 1983-07-28 | 松下電器産業株式会社 | フレキシブル印刷基板 |
-
1981
- 1981-09-17 JP JP14762381A patent/JPS5848496A/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4822747B1 (no) * | 1970-12-10 | 1973-07-09 | ||
JPS5225264A (en) * | 1975-08-21 | 1977-02-25 | Matsushita Electric Ind Co Ltd | Hybrid miniature parts |
JPS5426671B2 (no) * | 1976-02-26 | 1979-09-05 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63147115U (no) * | 1987-03-16 | 1988-09-28 | ||
JPH03503012A (ja) * | 1988-07-22 | 1991-07-11 | フォトフィニッシュ コスメチックス インコーポレーテッド | 成形ブラシおよびその製造法 |
Also Published As
Publication number | Publication date |
---|---|
JPS5848496A (ja) | 1983-03-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR860000188B1 (ko) | 혼성집적회로 부품 및 그 부착 방법 | |
US4873764A (en) | Component mounting process for printed circuit boards | |
JPS5998591A (ja) | 両面回路接続方法 | |
JP2757748B2 (ja) | プリント配線板 | |
JPS6230718B2 (no) | ||
JPS63114299A (ja) | プリント配線板 | |
JPS5823956B2 (ja) | インサツハイセンバン | |
JPH0378793B2 (no) | ||
JPS5994487A (ja) | フレキシブル両面配線板の表裏接続方法 | |
JPH0218594B2 (no) | ||
JPS6230719B2 (no) | ||
JPH0528917B2 (no) | ||
JP2715957B2 (ja) | 混成集積回路装置 | |
JP2580607B2 (ja) | 回路基板及び回路基板の製造方法 | |
JP2828752B2 (ja) | 混成集積回路装置 | |
JPS6163081A (ja) | 電子回路部品およびその実装方法 | |
JPS5880895A (ja) | 両面プリント回路用基板および両面プリント回路板装置ならびにその製法 | |
JPH06309523A (ja) | メモリカード | |
JPS60143618A (ja) | 電子部品 | |
JPS6230720B2 (no) | ||
JPH02871B2 (no) | ||
JPS6317589A (ja) | 二層プリント回路基板 | |
JPS58143598A (ja) | 電子回路部品 | |
JPH03255691A (ja) | プリント配線板 | |
JPS5841677B2 (ja) | 微小素子回路用基板 |