JPS6230496B2 - - Google Patents

Info

Publication number
JPS6230496B2
JPS6230496B2 JP12919079A JP12919079A JPS6230496B2 JP S6230496 B2 JPS6230496 B2 JP S6230496B2 JP 12919079 A JP12919079 A JP 12919079A JP 12919079 A JP12919079 A JP 12919079A JP S6230496 B2 JPS6230496 B2 JP S6230496B2
Authority
JP
Japan
Prior art keywords
lead frame
lead
slit
leads
connecting portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP12919079A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5651850A (en
Inventor
Shoichi Ogura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP12919079A priority Critical patent/JPS5651850A/ja
Publication of JPS5651850A publication Critical patent/JPS5651850A/ja
Publication of JPS6230496B2 publication Critical patent/JPS6230496B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP12919079A 1979-10-05 1979-10-05 Lead frame Granted JPS5651850A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12919079A JPS5651850A (en) 1979-10-05 1979-10-05 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12919079A JPS5651850A (en) 1979-10-05 1979-10-05 Lead frame

Publications (2)

Publication Number Publication Date
JPS5651850A JPS5651850A (en) 1981-05-09
JPS6230496B2 true JPS6230496B2 (ko) 1987-07-02

Family

ID=15003361

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12919079A Granted JPS5651850A (en) 1979-10-05 1979-10-05 Lead frame

Country Status (1)

Country Link
JP (1) JPS5651850A (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58142937U (ja) * 1982-03-18 1983-09-27 三洋電機株式会社 リ−ドフレ−ム
JPS6252951A (ja) * 1985-09-02 1987-03-07 Kyosei:Kk 対をなす多数の部品の接続方法
US4721993A (en) * 1986-01-31 1988-01-26 Olin Corporation Interconnect tape for use in tape automated bonding
KR20010108539A (ko) * 2000-05-29 2001-12-08 마이클 디. 오브라이언 반도체칩 탑재부재
JP6113339B1 (ja) 2016-08-01 2017-04-12 出光ユニテック株式会社 テープ及び袋体

Also Published As

Publication number Publication date
JPS5651850A (en) 1981-05-09

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