JPS6230340U - - Google Patents

Info

Publication number
JPS6230340U
JPS6230340U JP1985121833U JP12183385U JPS6230340U JP S6230340 U JPS6230340 U JP S6230340U JP 1985121833 U JP1985121833 U JP 1985121833U JP 12183385 U JP12183385 U JP 12183385U JP S6230340 U JPS6230340 U JP S6230340U
Authority
JP
Japan
Prior art keywords
metal wire
discharge electrode
detection circuit
computer
contact detection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985121833U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0231787Y2 (cg-RX-API-DMAC10.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985121833U priority Critical patent/JPH0231787Y2/ja
Publication of JPS6230340U publication Critical patent/JPS6230340U/ja
Application granted granted Critical
Publication of JPH0231787Y2 publication Critical patent/JPH0231787Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H10W72/0711
    • H10W72/01551
    • H10W72/07141
    • H10W72/075
    • H10W72/07511
    • H10W72/07521
    • H10W72/536
    • H10W72/5363
    • H10W90/756

Landscapes

  • Wire Bonding (AREA)
JP1985121833U 1985-08-08 1985-08-08 Expired JPH0231787Y2 (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985121833U JPH0231787Y2 (cg-RX-API-DMAC10.html) 1985-08-08 1985-08-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985121833U JPH0231787Y2 (cg-RX-API-DMAC10.html) 1985-08-08 1985-08-08

Publications (2)

Publication Number Publication Date
JPS6230340U true JPS6230340U (cg-RX-API-DMAC10.html) 1987-02-24
JPH0231787Y2 JPH0231787Y2 (cg-RX-API-DMAC10.html) 1990-08-28

Family

ID=31011464

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985121833U Expired JPH0231787Y2 (cg-RX-API-DMAC10.html) 1985-08-08 1985-08-08

Country Status (1)

Country Link
JP (1) JPH0231787Y2 (cg-RX-API-DMAC10.html)

Also Published As

Publication number Publication date
JPH0231787Y2 (cg-RX-API-DMAC10.html) 1990-08-28

Similar Documents

Publication Publication Date Title
KR950009619B1 (ko) 반도체장치의 와이어 본딩방법
EP0297244A3 (en) Single lead automatic clamping and bonding system
JPH0421341B2 (cg-RX-API-DMAC10.html)
JP2617351B2 (ja) ワイヤ接続不良検出方法
JPS6230340U (cg-RX-API-DMAC10.html)
JP2722886B2 (ja) ワイヤボンディング装置
JPS61159746A (ja) Icモジユ−ルのワイヤボンデイング方法
JPS5939931U (ja) ワイヤボンデイング装置
JPS5826524Y2 (ja) ハンドウタイワイヤボンダソウチ
JPS58180633U (ja) ワ−ク位置決め装置
JP2765833B2 (ja) 半導体装置のワイヤボンディング方法
JPS63188945U (cg-RX-API-DMAC10.html)
JPS60187537U (ja) 自動ワイヤボンダ
JPS58105138U (ja) 半導体装置用自動ボンデイング装置
JPH0447973B2 (cg-RX-API-DMAC10.html)
JPS57103325A (en) Wire bonding method
JPS6255942A (ja) ボンデイング方法
JPS59145033U (ja) ワイヤボンデイング装置
JPH0252335U (cg-RX-API-DMAC10.html)
JPH07161752A (ja) ボンディング装置及びボンディング方法
JPS62188231A (ja) ボンデイング装置
JPH0789559B2 (ja) ワイヤ−ボンデイング装置
JPH08236573A (ja) ワイヤボンディング装置
JPS61159747A (ja) ワイヤ−・ボンデイング装置
JPH039525A (ja) バンプ形成方法及びその形成装置