JPH0252335U - - Google Patents

Info

Publication number
JPH0252335U
JPH0252335U JP1988128721U JP12872188U JPH0252335U JP H0252335 U JPH0252335 U JP H0252335U JP 1988128721 U JP1988128721 U JP 1988128721U JP 12872188 U JP12872188 U JP 12872188U JP H0252335 U JPH0252335 U JP H0252335U
Authority
JP
Japan
Prior art keywords
bonding
wire
semiconductor element
inner lead
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988128721U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988128721U priority Critical patent/JPH0252335U/ja
Publication of JPH0252335U publication Critical patent/JPH0252335U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/0711
    • H10W72/07141
    • H10W72/075
    • H10W72/07521

Landscapes

  • Wire Bonding (AREA)
JP1988128721U 1988-09-30 1988-09-30 Pending JPH0252335U (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988128721U JPH0252335U (cg-RX-API-DMAC10.html) 1988-09-30 1988-09-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988128721U JPH0252335U (cg-RX-API-DMAC10.html) 1988-09-30 1988-09-30

Publications (1)

Publication Number Publication Date
JPH0252335U true JPH0252335U (cg-RX-API-DMAC10.html) 1990-04-16

Family

ID=31382327

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988128721U Pending JPH0252335U (cg-RX-API-DMAC10.html) 1988-09-30 1988-09-30

Country Status (1)

Country Link
JP (1) JPH0252335U (cg-RX-API-DMAC10.html)

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