JPS62293629A - 半導体装置の加速寿命試験方法 - Google Patents

半導体装置の加速寿命試験方法

Info

Publication number
JPS62293629A
JPS62293629A JP13737786A JP13737786A JPS62293629A JP S62293629 A JPS62293629 A JP S62293629A JP 13737786 A JP13737786 A JP 13737786A JP 13737786 A JP13737786 A JP 13737786A JP S62293629 A JPS62293629 A JP S62293629A
Authority
JP
Japan
Prior art keywords
wafer
spacer
heater
needles
semiconductor devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13737786A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0584670B2 (enExample
Inventor
Kazuyoshi Nasu
那須　一喜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP13737786A priority Critical patent/JPS62293629A/ja
Publication of JPS62293629A publication Critical patent/JPS62293629A/ja
Publication of JPH0584670B2 publication Critical patent/JPH0584670B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP13737786A 1986-06-12 1986-06-12 半導体装置の加速寿命試験方法 Granted JPS62293629A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13737786A JPS62293629A (ja) 1986-06-12 1986-06-12 半導体装置の加速寿命試験方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13737786A JPS62293629A (ja) 1986-06-12 1986-06-12 半導体装置の加速寿命試験方法

Publications (2)

Publication Number Publication Date
JPS62293629A true JPS62293629A (ja) 1987-12-21
JPH0584670B2 JPH0584670B2 (enExample) 1993-12-02

Family

ID=15197261

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13737786A Granted JPS62293629A (ja) 1986-06-12 1986-06-12 半導体装置の加速寿命試験方法

Country Status (1)

Country Link
JP (1) JPS62293629A (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6435926A (en) * 1987-07-30 1989-02-07 Tokyo Electron Ltd Reliability testing system for semiconductor element
US5219765A (en) * 1990-09-12 1993-06-15 Hitachi, Ltd. Method for manufacturing a semiconductor device including wafer aging, probe inspection, and feeding back the results of the inspection to the device fabrication process
US5291127A (en) * 1991-05-03 1994-03-01 Samsung Electronics Co., Ltd. Chip-lifetime testing instrument for semiconductor devices
US5315240A (en) * 1991-05-31 1994-05-24 Ej Systems, Inc. Thermal control system for a semi-conductor burn-in
US5539324A (en) * 1988-09-30 1996-07-23 Micron Technology, Inc. Universal wafer carrier for wafer level die burn-in
US5726580A (en) * 1990-08-29 1998-03-10 Micron Technology, Inc. Universal wafer carrier for wafer level die burn-in
US5952840A (en) * 1996-12-31 1999-09-14 Micron Technology, Inc. Apparatus for testing semiconductor wafers
US7511520B2 (en) 1990-08-29 2009-03-31 Micron Technology, Inc. Universal wafer carrier for wafer level die burn-in

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57179168U (enExample) * 1981-05-07 1982-11-13
JPS5974729U (ja) * 1982-11-10 1984-05-21 クラリオン株式会社 試料測定装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57179168U (enExample) * 1981-05-07 1982-11-13
JPS5974729U (ja) * 1982-11-10 1984-05-21 クラリオン株式会社 試料測定装置

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6435926A (en) * 1987-07-30 1989-02-07 Tokyo Electron Ltd Reliability testing system for semiconductor element
US5539324A (en) * 1988-09-30 1996-07-23 Micron Technology, Inc. Universal wafer carrier for wafer level die burn-in
US7161373B2 (en) 1990-08-29 2007-01-09 Micron Technology, Inc. Method for testing using a universal wafer carrier for wafer level die burn-in
US6087845A (en) * 1990-08-29 2000-07-11 Micron Technology, Inc. Universal wafer carrier for wafer level die burn-in
US7511520B2 (en) 1990-08-29 2009-03-31 Micron Technology, Inc. Universal wafer carrier for wafer level die burn-in
US5726580A (en) * 1990-08-29 1998-03-10 Micron Technology, Inc. Universal wafer carrier for wafer level die burn-in
US5859539A (en) * 1990-08-29 1999-01-12 Micron Technology, Inc. Universal wafer carrier for wafer level die burn-in
US7362113B2 (en) 1990-08-29 2008-04-22 Micron Technology, Inc. Universal wafer carrier for wafer level die burn-in
US7288953B2 (en) 1990-08-29 2007-10-30 Micron Technology, Inc. Method for testing using a universal wafer carrier for wafer level die burn-in
US7167012B2 (en) 1990-08-29 2007-01-23 Micron Technology, Inc. Universal wafer carrier for wafer level die burn-in
US6091254A (en) * 1990-08-29 2000-07-18 Micron Technology, Inc. Universal wafer carrier for wafer level die burn-in
US6737882B2 (en) 1990-08-29 2004-05-18 Micron Technology, Inc. Method for universal wafer carrier for wafer level die burn-in
US7167014B2 (en) 1990-08-29 2007-01-23 Micron Technology, Inc. Method for testing using a universal wafer carrier for wafer level die burn-in
US6535012B1 (en) 1990-08-29 2003-03-18 Micron Technology, Inc. Universal wafer carrier for wafer level die burn-in
US6342789B1 (en) 1990-08-29 2002-01-29 Micron Technology, Inc. Universal wafer carrier for wafer level die burn-in
US7112985B2 (en) 1990-08-29 2006-09-26 Micron Technology, Inc. Method for testing using a universal wafer carrier for wafer level die burn-in
US7112986B2 (en) 1990-08-29 2006-09-26 Micron Technology, Inc. Method for testing using a universal wafer carrier for wafer level die burn-in
US7141997B2 (en) 1990-08-29 2006-11-28 Micron Technology, Inc. Method for testing using a universal wafer carrier for wafer level die burn-in
US5219765A (en) * 1990-09-12 1993-06-15 Hitachi, Ltd. Method for manufacturing a semiconductor device including wafer aging, probe inspection, and feeding back the results of the inspection to the device fabrication process
US5291127A (en) * 1991-05-03 1994-03-01 Samsung Electronics Co., Ltd. Chip-lifetime testing instrument for semiconductor devices
US5315240A (en) * 1991-05-31 1994-05-24 Ej Systems, Inc. Thermal control system for a semi-conductor burn-in
US6362637B2 (en) 1996-12-31 2002-03-26 Micron Technology, Inc. Apparatus for testing semiconductor wafers including base with contact members and terminal contacts
US6064216A (en) * 1996-12-31 2000-05-16 Micron Technology, Inc. Apparatus for testing semiconductor wafers
US5952840A (en) * 1996-12-31 1999-09-14 Micron Technology, Inc. Apparatus for testing semiconductor wafers

Also Published As

Publication number Publication date
JPH0584670B2 (enExample) 1993-12-02

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