JPS62291094A - Manufacture of ceramic multilayer board - Google Patents
Manufacture of ceramic multilayer boardInfo
- Publication number
- JPS62291094A JPS62291094A JP13414386A JP13414386A JPS62291094A JP S62291094 A JPS62291094 A JP S62291094A JP 13414386 A JP13414386 A JP 13414386A JP 13414386 A JP13414386 A JP 13414386A JP S62291094 A JPS62291094 A JP S62291094A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- ceramic multilayer
- base metal
- multilayer substrate
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims description 37
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 239000000758 substrate Substances 0.000 claims description 16
- 239000010953 base metal Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 12
- 229910044991 metal oxide Inorganic materials 0.000 claims description 11
- 150000004706 metal oxides Chemical class 0.000 claims description 11
- 238000010304 firing Methods 0.000 claims description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 8
- 239000012298 atmosphere Substances 0.000 claims description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 4
- 239000007789 gas Substances 0.000 claims description 4
- 239000001257 hydrogen Substances 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical group [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 3
- 239000005751 Copper oxide Substances 0.000 claims description 3
- 229910000431 copper oxide Inorganic materials 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910000480 nickel oxide Inorganic materials 0.000 claims description 3
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical group [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 claims description 3
- 238000005245 sintering Methods 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- 239000000463 material Substances 0.000 description 7
- 229910052759 nickel Inorganic materials 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000012299 nitrogen atmosphere Substances 0.000 description 4
- 238000010292 electrical insulation Methods 0.000 description 3
- 229910000510 noble metal Inorganic materials 0.000 description 2
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
３、発明の詳細な説明
産業上の利用分野
本発明は、ハイブリッドＩＣ等に利用されるセラミック
多層基板の製造方法に関するものである。Detailed Description of the Invention 3. Detailed Description of the Invention Field of Industrial Application The present invention relates to a method of manufacturing a ceramic multilayer substrate used in hybrid ICs and the like.
従来の技術
従来のグリーンシート積層法によるセラミック多層基板
の製造方法は、導体材料に金、銀、銀パラジウム合金等
の資金層を使用し、その導体材料によりグリーンシート
上に所定の配線パターンを形成した後に積層して空気中
で焼成する方法と、導体材料に銅、ニッケル、タングス
テン、モリブデン等の卑金属を使用し、同様にして窒素
雰囲気で焼成する方法の大別して２種類の方法がある。Conventional technology The conventional method for manufacturing ceramic multilayer boards using the green sheet lamination method uses a layer of gold, silver, silver-palladium alloy, etc. as the conductor material, and forms a predetermined wiring pattern on the green sheet using the conductor material. There are two types of methods: one in which the conductive material is laminated and then fired in air, and the other in which a base metal such as copper, nickel, tungsten, or molybdenum is used as the conductor material and fired in a nitrogen atmosphere in the same way.
発明が解決しようとする問題点
ところが、導体材料に貴金属を使用する場合は、コスト
が非常に高くなる欠点を有している。！、た、導体材料
に卑金属を使用する場合は、コストは安価であるが、脱
バインダ一工程でグリーンシート中の有機成分を完全に
除去する為に空気中で焼成を行うと、卑金属は酸化され
、著しく体積膨張を起し、セラミックにクラックが入っ
てしまう。よって、脱バインダ一工程も窒素雰囲気で焼
成する必要があるが、窒素雰囲気ではグリーンシート中
の有機成分が完全に分解・除去されず残留炭素分が電気
的絶縁性の性能低下を引き起したり、基板の機械的強度
も弱くなってし甘う。さらに、窒素雰囲気で完全に分解
できる有機材料をグリーンシートのバインダーとして使
用する場合、バインダー組成の材料設計の自由度が小さ
くなってしまうという問題点があった。Problems to be Solved by the Invention However, when noble metals are used as conductor materials, there is a drawback that the cost is extremely high. ! However, when base metals are used as conductor materials, the cost is low, but if baking is performed in air to completely remove the organic components in the green sheet in one debinding process, the base metals will be oxidized. , causing significant volume expansion and cracks in the ceramic. Therefore, the first step of debinding requires firing in a nitrogen atmosphere, but in a nitrogen atmosphere, the organic components in the green sheet are not completely decomposed and removed, and the residual carbon content may cause a decline in electrical insulation performance. This also weakens the mechanical strength of the board. Furthermore, when an organic material that can be completely decomposed in a nitrogen atmosphere is used as a binder for a green sheet, there is a problem in that the degree of freedom in material design of the binder composition is reduced.
本発明はこのような従来の問題点を解決するものであり
、簡単な構成で低コストかつ信頼性に優れるセラミック
多層基板の製造方法を提供するものである。The present invention solves these conventional problems, and provides a method for manufacturing a ceramic multilayer substrate with a simple structure, low cost, and excellent reliability.
問題点を解決するだめの手段
本発明のセラミック多層基板の製造方法は、グリーンシ
ート上に卑金属酸化物により所定の回路パターンを形成
した後、前記グリーンシートを複数枚積層圧着して空気
中で焼成を行いグリーンシート中の有機成分を除去し、
さらに水素と窒素を混合したガス雰囲気中で焼成を行い
セラミック成分を焼結させると共に卑金属酸化物を還元
することにより金属化し、かつその金属を焼結させてセ
ラミック多層基板を製造するものである。Means for Solving the Problems The method for manufacturing a ceramic multilayer board of the present invention involves forming a predetermined circuit pattern on a green sheet using a base metal oxide, and then laminating and pressing a plurality of the green sheets and firing them in air. The organic components in the green sheet are removed by
Further, firing is performed in a gas atmosphere containing a mixture of hydrogen and nitrogen to sinter the ceramic components, reduce the base metal oxide to metallize it, and sinter the metal to produce a ceramic multilayer substrate.
作 用
本発明のセラミック多層基板の製造方法では、導体材料
に卑金属酸化物を使用するために、脱バインダ一工程は
空気中で焼成することが出来るので、グリーンシート中
の有機成分を完全に除去することができ、かつ導体材料
が酸化されて体積膨張を起すこともないので、セラミッ
クにクラックが入ることもない。また卑金属酸化物を使
用するために大幅なコストダウンが図れ、還元雰囲気焼
成を行った後も導体の比抵抗は、従来の銀パラジウムが
２０〜３０鰭Ω／口に対し、銅は２〜３咽Ω／口、ニッ
ケルは１０〜２０ ｍｍΩ／口と低く性能的にも優るも
のである。Function: In the method for manufacturing a ceramic multilayer substrate of the present invention, since a base metal oxide is used as the conductive material, the first step of removing the binder can be fired in air, so organic components in the green sheet can be completely removed. Moreover, since the conductive material is not oxidized and volumetric expansion does not occur, the ceramic does not crack. In addition, the use of base metal oxides significantly reduces costs, and even after firing in a reducing atmosphere, the specific resistance of the conductor is 20 to 30 Ω/mouth for conventional silver palladium, while copper is 2 to 3 Ω/mouth. The throat Ω/mouth and nickel are low at 10 to 20 mmΩ/mouth and have excellent performance.
実施例
以下、本発明の一実施例のセラミック多層基板の製造方
法を図面を参照して説明する。EXAMPLE Hereinafter, a method for manufacturing a ceramic multilayer substrate according to an example of the present invention will be explained with reference to the drawings.
実施例１
第１図に示すように各セラミックグリーンシート１ａ、
１ｂ、１ｃ、１ｄに卑金属酸化物の一つである酸化銅を
主成分とするペーストにより所定の回路パターン２ａ、
２ｂ、２ｃ、２ｄを形成し、第２図に示すように、この
回路パターンが形成されたグリーンシート１ａ、１ｂ、
１ｅ、１ｄを４枚積層圧着し、空気中で５００℃で約２
時間焼成を行い、グリーンシート中の有機成分を充分に
除去する。さらに、水素と窒素を混合したガス雰囲気中
で、９００℃で約１時間焼成を行い有機成分が除去され
たセラミックグリーンシート１ａ、１ｂ。Example 1 As shown in FIG. 1, each ceramic green sheet 1a,
A predetermined circuit pattern 2a is formed on 1b, 1c, and 1d using a paste whose main component is copper oxide, which is one of the base metal oxides.
2b, 2c, 2d, and as shown in FIG.
Four sheets of 1e and 1d are laminated and crimped, and heated at 500℃ in air for about 2
The organic components in the green sheet are sufficiently removed by firing for a certain amount of time. Furthermore, the ceramic green sheets 1a and 1b were fired at 900° C. for about 1 hour in a gas atmosphere containing a mixture of hydrogen and nitrogen to remove organic components.
１Ｃ２１ｄを焼結させて、セラミック層ｓａ、ｓｂ。1C21d is sintered to form ceramic layers sa and sb.
つ、その銅も焼結させて前記導体ぺ〜スト２ａ 。Then, the copper is also sintered to form the conductor paste 2a.
２ｂ、２ｃ、２ｄと同一形状の導体層４ａ、４ｂ。Conductor layers 4a, 4b having the same shape as 2b, 2c, 2d.
４Ｃ２４ｄを有するセラミック多層基板を製造する。こ
の完成した状態を第３図に示す。この時、６ へ−
セラミック層の電気絶縁性は優れ、導体層である銅も良
好な導電性を示すセラミック多層基板が得られた。A ceramic multilayer substrate having 4C24d is manufactured. This completed state is shown in FIG. At this time, a ceramic multilayer substrate was obtained in which the electrical insulation of the ceramic layer was excellent and the copper serving as the conductor layer also exhibited good conductivity.
実施例２
第１の実施例における酸化銅を酸化ニッケルに代えだペ
ーストにより、各セラミックグリーンシートに所定の回
路パターンを印刷し、これらのグリーンシートを４枚積
層し、空気中で５００Ｃで約２時間焼成を行いグリーン
シート中の有機成分を充分に除去した後、水素と窒素を
混合したガス雰囲気で、１００ｏ℃で１時間焼成を行い
、セラミックを焼結させると共に酸化ニッケルを還元し
てニッケルとし、このニッケルも焼結させてセラミック
多層基板を製造した。このときセラミック層の電気絶縁
性は優れ、導体層であるニッケルも良好な導電性を示す
セラミック多層基板が得られた。Example 2 Copper oxide in the first example was replaced with nickel oxide. A predetermined circuit pattern was printed on each ceramic green sheet using a paste. Four of these green sheets were stacked and heated in air at 500C for about 2 hours. After sufficiently removing the organic components in the green sheet through time firing, firing was performed at 100°C for 1 hour in a gas atmosphere containing hydrogen and nitrogen to sinter the ceramic and reduce the nickel oxide to nickel. This nickel was also sintered to produce a ceramic multilayer substrate. At this time, a ceramic multilayer substrate was obtained in which the electrical insulation of the ceramic layer was excellent and the nickel as the conductor layer also showed good conductivity.
発明の効果
以上のように本発明のセラミック多層基板の製造方法で
は、導体材料の出発原料に卑金属酸化物７へ
を使用するために脱バインダ一工程は空気中で焼成する
ことが出来るので、グリーンシー ト中の有機成分を完
全に分解・除去でき、セラミック多層基板の信頼性を高
めることができる。また、本焼成では還元雰囲気で焼成
するために卑金属酸化物は還元されて金属となり、卑金
属の性質は従来の貴金属に比べて導電性、マイグレーシ
ョン性、半田ぬれ性に優れ、コストも約１／１００〜１
／１ｏ○００と大幅なコストダウンが図れる。もって、
高性能。Effects of the Invention As described above, in the method for manufacturing a ceramic multilayer board of the present invention, since the base metal oxide 7 is used as the starting material for the conductor material, the first step of removing the binder can be fired in air, so it is green. Organic components in the sheet can be completely decomposed and removed, increasing the reliability of ceramic multilayer substrates. In addition, since the main firing is performed in a reducing atmosphere, base metal oxides are reduced to metals, and the properties of base metals are superior in conductivity, migration, and solderability compared to conventional noble metals, and the cost is approximately 1/100. ~1
/1o○00, resulting in a significant cost reduction. With that,
High performance.
高信頼性かつ非常に安価なセラミック多層基板を提供で
きる実用上極めて有用なものである。This is extremely useful in practice as it can provide a highly reliable and very inexpensive ceramic multilayer substrate.
第１図、第２図及び第３図は本発明のセラミック多層基
板の製造方法の一実施例の各工程におけるセラミック基
板を示す断面図である。
１ａ、１ｂ、１ｃ、１ｄ・・・・・・セラミックグリー
ンシート、２ａ 、２ｂ 、２ｃ 、２ｄ−・＝導体ペ
ースト、３ａ、３ｂｌ ３Ｃ＋ ３ｄ”・”’セラミッ
ク層、４ａ。
４ｂ、４ｃ、４ｄ・・・・・・導体。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第２
図FIGS. 1, 2, and 3 are cross-sectional views showing a ceramic substrate in each step of an embodiment of the method for manufacturing a ceramic multilayer substrate of the present invention. 1a, 1b, 1c, 1d... Ceramic green sheet, 2a, 2b, 2c, 2d--=conductor paste, 3a, 3bl 3C+ 3d"/"' Ceramic layer, 4a. 4b, 4c, 4d... Conductors. Name of agent: Patent attorney Toshio Nakao and 1 other person 2nd
figure
Claims (3)
卑金属酸化物を主成分とするペーストにより、所定の回
路パターンを形成し、前記セラミックグリーンシートを
複数枚積層圧着した後、空気中で焼成を行いセラミック
グリーンシート中の有機成分を除去し、次に、水素と窒
素を混合したガス雰囲気中で焼成を行い、前記セラミッ
クグリーンシートのセラミック成分を焼結させると共に
卑金属酸化物を還元することにより金属化し、さらにそ
の金属を焼結させることを特徴とするセラミック多層基
板の製造方法。(1) A predetermined circuit pattern is formed on a plurality of ceramic green sheets using a paste whose main component is a base metal oxide, and after the plurality of ceramic green sheets are laminated and pressure-bonded, the ceramic green sheets are fired in air. The organic components in the green sheet are removed, and then firing is performed in a gas atmosphere containing a mixture of hydrogen and nitrogen to sinter the ceramic components of the ceramic green sheet and metallize it by reducing the base metal oxide, A method for manufacturing a ceramic multilayer substrate, which further comprises sintering the metal.
許請求の範囲第１項記載のセラミック多層基板の製造方
法。(2) The method for manufacturing a ceramic multilayer substrate according to claim 1, wherein the base metal oxide is copper oxide.
する特許請求の範囲第１項記載のセラミック多層基板の
製造方法。(3) The method for manufacturing a ceramic multilayer substrate according to claim 1, wherein the base metal oxide is nickel oxide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13414386A JPH0685468B2 (en) | 1986-06-10 | 1986-06-10 | Method for manufacturing ceramic multilayer substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13414386A JPH0685468B2 (en) | 1986-06-10 | 1986-06-10 | Method for manufacturing ceramic multilayer substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62291094A true JPS62291094A (en) | 1987-12-17 |
| JPH0685468B2 JPH0685468B2 (en) | 1994-10-26 |
Family
ID=15121474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13414386A Expired - Fee Related JPH0685468B2 (en) | 1986-06-10 | 1986-06-10 | Method for manufacturing ceramic multilayer substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0685468B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01231398A (en) * | 1988-03-11 | 1989-09-14 | Matsushita Electric Ind Co Ltd | Ceramic multilayer interconnection board and preparation thereof |
| JP2004253794A (en) * | 2003-01-29 | 2004-09-09 | Fuji Photo Film Co Ltd | Ink for forming printed wiring board, method for forming printed wiring board, and the printed wiring board |
-
1986
- 1986-06-10 JP JP13414386A patent/JPH0685468B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01231398A (en) * | 1988-03-11 | 1989-09-14 | Matsushita Electric Ind Co Ltd | Ceramic multilayer interconnection board and preparation thereof |
| JP2004253794A (en) * | 2003-01-29 | 2004-09-09 | Fuji Photo Film Co Ltd | Ink for forming printed wiring board, method for forming printed wiring board, and the printed wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0685468B2 (en) | 1994-10-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |