JPS62282452A - 集積回路冷却装置 - Google Patents

集積回路冷却装置

Info

Publication number
JPS62282452A
JPS62282452A JP61017031A JP1703186A JPS62282452A JP S62282452 A JPS62282452 A JP S62282452A JP 61017031 A JP61017031 A JP 61017031A JP 1703186 A JP1703186 A JP 1703186A JP S62282452 A JPS62282452 A JP S62282452A
Authority
JP
Japan
Prior art keywords
integrated circuit
heat
fins
heat dissipating
circuit cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61017031A
Other languages
English (en)
Japanese (ja)
Other versions
JPH046099B2 (enExample
Inventor
Mitsuhiko Nakada
仲田　光彦
Yukihisa Katsuyama
勝山　幸寿
Masahiro Suzuki
正博 鈴木
Haruhiko Yamamoto
治彦 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP61017031A priority Critical patent/JPS62282452A/ja
Priority to DE86307669T priority patent/DE3688962T2/de
Priority to EP92100517A priority patent/EP0484320B1/en
Priority to US06/914,942 priority patent/US4879632A/en
Priority to DE3650719T priority patent/DE3650719T2/de
Priority to EP92100516A priority patent/EP0483107B1/en
Priority to DE3650709T priority patent/DE3650709T2/de
Priority to EP86307669A priority patent/EP0217676B1/en
Priority to US07/079,877 priority patent/US4783721A/en
Publication of JPS62282452A publication Critical patent/JPS62282452A/ja
Priority to US07/261,904 priority patent/US5126919A/en
Publication of JPH046099B2 publication Critical patent/JPH046099B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4332—Bellows
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735—Jet impingement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP61017031A 1985-10-04 1986-01-28 集積回路冷却装置 Granted JPS62282452A (ja)

Priority Applications (10)

Application Number Priority Date Filing Date Title
JP61017031A JPS62282452A (ja) 1986-01-28 1986-01-28 集積回路冷却装置
EP92100516A EP0483107B1 (en) 1986-01-28 1986-10-03 Cooling modules for electronic circuit devices
EP92100517A EP0484320B1 (en) 1985-11-19 1986-10-03 Cooling modules for electronic circuit devices
US06/914,942 US4879632A (en) 1985-10-04 1986-10-03 Cooling system for an electronic circuit device
DE3650719T DE3650719T2 (de) 1985-11-19 1986-10-03 Kühlmodule für Vorrichtungen mit elektronischem Schaltkreis
DE86307669T DE3688962T2 (de) 1985-10-04 1986-10-03 Kühlsystem für eine elektronische Schaltungsanordnung.
DE3650709T DE3650709T2 (de) 1986-01-28 1986-10-03 Kühlmodule für Vorrichtungen mit elektronischem Schaltkreis
EP86307669A EP0217676B1 (en) 1985-10-04 1986-10-03 Cooling system for electronic circuit device
US07/079,877 US4783721A (en) 1985-10-04 1987-07-30 Cooling system for an electronic circuit device
US07/261,904 US5126919A (en) 1985-10-04 1988-10-25 Cooling system for an electronic circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61017031A JPS62282452A (ja) 1986-01-28 1986-01-28 集積回路冷却装置

Publications (2)

Publication Number Publication Date
JPS62282452A true JPS62282452A (ja) 1987-12-08
JPH046099B2 JPH046099B2 (enExample) 1992-02-04

Family

ID=11932628

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61017031A Granted JPS62282452A (ja) 1985-10-04 1986-01-28 集積回路冷却装置

Country Status (3)

Country Link
EP (1) EP0483107B1 (enExample)
JP (1) JPS62282452A (enExample)
DE (1) DE3650709T2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004183646A (ja) * 2002-09-13 2004-07-02 Oliver Laing 対象物の局部的な冷却または加熱のための装置
JP2008306203A (ja) * 2008-07-24 2008-12-18 Hitachi Ltd 電子機器冷却装置並びに電子機器冷却装置のポンプ一体型冷却モジュール

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4217597C2 (de) * 1992-05-27 1994-09-08 Siemens Nixdorf Inf Syst Einbausystem für auf Leiterplatten montierte hochintegrierte gehäuselose Bausteine
CN105704983B (zh) * 2016-02-25 2017-11-21 上海斐讯数据通信技术有限公司 一种辅助散热装置及家用电子设备
CN106170192A (zh) * 2016-07-05 2016-11-30 联想(北京)有限公司 一种电子设备

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60160149A (ja) * 1984-01-26 1985-08-21 Fujitsu Ltd 集積回路装置の冷却方式

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004183646A (ja) * 2002-09-13 2004-07-02 Oliver Laing 対象物の局部的な冷却または加熱のための装置
JP2008306203A (ja) * 2008-07-24 2008-12-18 Hitachi Ltd 電子機器冷却装置並びに電子機器冷却装置のポンプ一体型冷却モジュール

Also Published As

Publication number Publication date
DE3650709T2 (de) 1999-05-27
EP0483107A2 (en) 1992-04-29
EP0483107B1 (en) 1999-01-20
JPH046099B2 (enExample) 1992-02-04
EP0483107A3 (enExample) 1995-05-17
DE3650709D1 (de) 1999-03-04

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees